Inventor
SENGUL ALI
CH5 patents
Patents
5 patentsUS11563142B2Jan 24, 2023
Curing pre-applied and plasma-etched underfill via a laser
FACEBOOK TECH LLC1 citations71
US11374148B2Jun 28, 2022
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
FACEBOOK TECH LLC2 citations70
US11575069B2Feb 7, 2023
Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers
FACEBOOK TECH LLC0 citations59
US11735689B2Aug 22, 2023
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
FACEBOOK TECH LLC0 citations58
US11404600B2Aug 2, 2022
Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers
FACEBOOK TECH LLC0 citations50