Inventor
SHEN FU-YUN
CN34 patents
⚠️ This page may combine multiple inventors who share the name “SHEN FU-YUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AVARY HOLDING SHENZHEN CO LTD
20 patentsUS11197368B1Dec 7, 2021
High-frequency circuit board and method for manufacturing the same
AVARY HOLDING SHENZHEN CO LTD4 citations72
US10575406B1Feb 25, 2020
Method of making flexible circuit board
AVARY HOLDING SHENZHEN CO LTD2 citations72
US10104771B1Oct 16, 2018
Method for making a circuit board
AVARY HOLDING SHENZHEN CO LTD2 citations71
US12529612B2Jan 20, 2026
Pressure sensor, pressure-sensitive circuit board, and manufacturing method for pressure-sensitive circuit board
AVARY HOLDING SHENZHEN CO LTD0 citations62
US12369275B2Jul 22, 2025
Heat equalization plate
AVARY HOLDING SHENZHEN CO LTD0 citations62
US12320718B2Jun 3, 2025
Pressure sensing circuit board and method for manufacturing the same
AVARY HOLDING SHENZHEN CO LTD0 citations62
US11700685B2Jul 11, 2023
Method for manufacturing the same
AVARY HOLDING SHENZHEN CO LTD0 citations62
US11672100B2Jun 6, 2023
Heat equalization plate and method for manufacturing the same
AVARY HOLDING SHENZHEN CO LTD0 citations62
US10205487B1Feb 12, 2019
Wireless power consortium device and method for manufacturing the same
AVARY HOLDING SHENZHEN CO LTD1 citations62
US11134564B1Sep 28, 2021
Transparent PCB and method for manufacturing the same
AVARY HOLDING SHENZHEN CO LTD1 citations61
US12048084B2Jul 23, 2024
Covering film, and circuit board and manufacturing method
AVARY HOLDING SHENZHEN CO LTD0 citations60
US11765818B2Sep 19, 2023
Method for manufacturing transmission circuit board
AVARY HOLDING SHENZHEN CO LTD1 citations60
US11380603B2Jul 5, 2022
Method for making a heat dissipation structure
AVARY HOLDING SHENZHEN CO LTD0 citations60
US11259405B2Feb 22, 2022
Transmission circuit board and method for manufacturing the same
AVARY HOLDING SHENZHEN CO LTD0 citations60
US10533811B2Jan 14, 2020
Heat dissipation device
AVARY HOLDING SHENZHEN CO LTD0 citations52
US11778752B2Oct 3, 2023
Circuit board with embedded electronic component and method for manufacturing the same
AVARY HOLDING SHENZHEN CO LTD0 citations51
US10660210B2May 19, 2020
Flexible circuit board
AVARY HOLDING SHENZHEN CO LTD0 citations51
US10278307B2Apr 30, 2019
Cooling plate and method for manufacturing thereof
AVARY HOLDING SHENZHEN CO LTD0 citations51
US12063752B2Aug 13, 2024
Methods of manufacturing circuit board and circuit board assembly
AVARY HOLDING SHENZHEN CO LTD0 citations47
US10365430B2Jul 30, 2019
Method for manufacturing high frequency signal transmission structure and high frequency signal transmission structure obtained thereby
AVARY HOLDING SHENZHEN CO LTD0 citations36
QING DING PREC ELECTRONICS HUAIAN CO LTD
6 patentsUS11665833B2May 30, 2023
Circuit board and manufacturing method thereof
QING DING PREC ELECTRONICS HUAIAN CO LTD0 citations62
US11297748B2Apr 5, 2022
Electromagnetic shielding film
QING DING PREC ELECTRONICS HUAIAN CO LTD0 citations62
US11212922B2Dec 28, 2021
Circuit board and manufacturing method thereof
QING DING PREC ELECTRONICS HUAIAN CO LTD0 citations62
US11979977B2May 7, 2024
Circuit board with heat dissipation structure and method for manufacturing same
QING DING PREC ELECTRONICS HUAIAN CO LTD1 citations60
US11457532B2Sep 27, 2022
Method of manufacturing circuit board
QING DING PREC ELECTRONICS HUAIAN CO LTD0 citations50
US11950357B2Apr 2, 2024
Circuit board for transmitting high-frequency signal and method for manufacturing the same
QING DING PREC ELECTRONICS HUAIAN CO LTD0 citations48
FUKUI PREC COMPONENT SHENZHEN
5 patentsUS9107311B2Aug 11, 2015
Method for manufacturing printed circuit board
FUKUI PREC COMPONENT SHENZHEN2 citations54
US10012454B2Jul 3, 2018
Heat dissipation device and method for manufacturing same
FUKUI PREC COMPONENT SHENZHEN0 citations51
US9357631B2May 31, 2016
Flexible printed circuit board and method for making same
FUKUI PREC COMPONENT SHENZHEN0 citations51
US9277640B2Mar 1, 2016
Flexible printed circuit board and method for manufacturing same
FUKUI PREC COMPONENT SHENZHEN1 citations51
US10658265B2May 19, 2020
Heat dissipation structure, method for making the same, and electronic device having the same
FUKUI PREC COMPONENT SHENZHEN0 citations50