Inventor
NAKAKO HIDEO
JP24 patents
⚠️ This page may combine multiple inventors who share the name “NAKAKO HIDEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
13 patentsUS10363608B2Jul 30, 2019
Copper paste for joining, method for producing joined body, and method for producing semiconductor device
HITACHI CHEMICAL CO LTD3 citations72
US11462502B2Oct 4, 2022
Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
HITACHI CHEMICAL CO LTD2 citations71
US11370066B2Jun 28, 2022
Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
HITACHI CHEMICAL CO LTD2 citations71
US10930612B2Feb 23, 2021
Copper paste for pressureless bonding, bonded body and semiconductor device
HITACHI CHEMICAL CO LTD1 citations61
US11040416B2Jun 22, 2021
Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
HITACHI CHEMICAL CO LTD0 citations51
US10748865B2Aug 18, 2020
Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
HITACHI CHEMICAL CO LTD0 citations51
US10201879B2Feb 12, 2019
Silver paste composition and semiconductor device using same
HITACHI CHEMICAL CO LTD0 citations51
US10174226B2Jan 8, 2019
Adhesive composition and semiconductor device using same
HITACHI CHEMICAL CO LTD0 citations51
US11887960B2Jan 30, 2024
Member connection method
HITACHI CHEMICAL CO LTD0 citations50
US11575076B2Feb 7, 2023
Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module
HITACHI CHEMICAL CO LTD0 citations50
US11483936B2Oct 25, 2022
Method for producing joined body, and joining material
HITACHI CHEMICAL CO LTD0 citations48
US10566304B2Feb 18, 2020
Assembly and semiconductor device
HITACHI CHEMICAL CO LTD0 citations40
US9550940B2Jan 24, 2017
Etching material
HITACHI CHEMICAL CO LTD0 citations37
SHOWA DENKO MATERIALS CO LTD
5 patentsUS11532588B2Dec 20, 2022
Copper paste for pressureless bonding, bonded body and semiconductor device
SHOWA DENKO MATERIALS CO LTD0 citations61
US12564879B2Mar 3, 2026
Copper paste for joining, method for manufacturing joined body, and joined body
SHOWA DENKO MATERIALS CO LTD0 citations60
US12354914B2Jul 8, 2025
Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation
SHOWA DENKO MATERIALS CO LTD0 citations59
US11890681B2Feb 6, 2024
Method for producing bonded object and semiconductor device and copper bonding paste
SHOWA DENKO MATERIALS CO LTD0 citations58
US12070800B2Aug 27, 2024
Electronic component and method for manufacturing electronic component
SHOWA DENKO MATERIALS CO LTD0 citations47
NAKAKO HIDEO
3 patentsUS9457406B2Oct 4, 2016
Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition
NAKAKO HIDEO5 citations69
US9676969B2Jun 13, 2017
Composition set, conductive substrate and method of producing the same, and conductive adhesive composition
NAKAKO HIDEO3 citations67
US8801971B2Aug 12, 2014
Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
NAKAKO HIDEO3 citations60