Inventor

ISHIKAWA DAI

JP54 patents

⚠️ This page may combine multiple inventors who share the name “ISHIKAWA DAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ISHIKAWA DAI

ASM IP HOLDING BV

Method for forming spacers using silicon nitride film for spacer-defined multiple patterning

Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches

Method for hydrophobization of surface of silicon-containing film by ALD

Method for repairing damage of dielectric film by cyclic processes

Selective deposition of metallic films

Method for forming SiOCH film using organoaminosilane annealing

Method for treating SiOCH film with hydrogen plasma

Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches

Reaction chamber passivation and selective deposition of metallic films

Reaction chamber passivation and selective deposition of metallic films

Selective deposition of metallic films

Reaction chamber passivation and selective deposition of metallic films

Heating/cooling pedestal for semiconductor-processing apparatus

Reaction chamber passivation and selective deposition of metallic films

Formation of SiN thin films

Formation of SiN thin films

Formation of SiN thin films

Method for etching a carbon-containing feature

Processes for preventing oxidation of metal thin films

Method for forming silicon nitride film selectively on top/bottom portions

Method of selectively depositing a capping layer structure on a semiconductor device structure

Method for forming silicon nitride film selectively on top surface

HITACHI CHEMICAL CO LTD

Copper paste for joining, method for producing joined body, and method for producing semiconductor device

Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device

Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device

Copper paste for pressureless bonding, bonded body and semiconductor device

Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device

Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device

Silver paste composition and semiconductor device using same

Adhesive composition and semiconductor device using same

Member connection method

RENESAS TECH CORP

Method for fabricating semiconductor devices

Method of manufacturing a semiconductor integrated circuit device

Method of manufacturing a semiconductor integrated circuit device

Method for fabricating semiconductor devices

OTSUKA PHARMA CO LTD

GD3-mimetic peptides

Neovascular-specific peptides

GD3-mimetic peptides

ABE TOMIYA

Coaxial cable and manufacturing method of the same

Coaxial cable

Insulation-coated wire

ISHIKAWA DAI

Method for supplying gas with flow rate gradient over substrate

Metal fine particle for conductive metal paste, conductive metal paste and metal film

PIONEER CORP

Audio apparatus

Information recording medium and reproducing apparatus therefor

RESONAC CORP

Copper paste, wick formation method, and heat pipe

Copper paste, wick formation method, and heat pipe

SHOWA DENKO MATERIALS CO LTD

Copper paste for pressureless bonding, bonded body and semiconductor device

Copper paste for joining, method for manufacturing joined body, and joined body

HAYASHI YAMATO

Producing method of metal fine particles or metal oxide fine particles, metal fine particles or metal oxide fine particles, and metal-containing paste, and metal film or metal oxide film