Inventor

EJIRI YOSHINORI

JP28 patents

⚠️ This page may combine multiple inventors who share the name “EJIRI YOSHINORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EJIRI YOSHINORI

HITACHI CHEMICAL CO LTD

Copper paste for joining, method for producing joined body, and method for producing semiconductor device

Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device

Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device

Organic interposer and method for manufacturing organic interposer

Organic interposer and method for manufacturing organic interposer

Copper paste for pressureless bonding, bonded body and semiconductor device

Composition containing organic solvents with different vapor pressures, conductor made from composition, method for manufacturing conductor, and structure comprising conductor

Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device

Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device

Member connection method

Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module

Method for producing joined body, and joining material

Assembly and semiconductor device

SHOWA DENKO MATERIALS CO LTD

Substrate and method for manufacturing the same

Copper paste for pressureless bonding, bonded body and semiconductor device

Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation

Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump

Solder particles

Method for producing bonded object and semiconductor device and copper bonding paste

Connection structure and manufacturing method therefor

Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses

Electronic component and method for manufacturing electronic component

EJIRI YOSHINORI

Substrate for mounting semiconductor chip and method for producing same

Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package

NAKAKO HIDEO

Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

RESONAC CORP

Copper paste, wick formation method, and heat pipe

Copper paste, wick formation method, and heat pipe