Inventor

LEE YING-NI

TW2 patents

⚠️ This page may combine multiple inventors who share the name “LEE YING-NI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VIA TECH INC

1 patent

US7615708B2Nov 10, 2009

Arrangement of non-signal through vias and wiring board applying the same

VIA TECH INC9 citations78

CHANG WEN-YUAN

1 patent

US8698325B2Apr 15, 2014

Integrated circuit package and physical layer interface arrangement

CHANG WEN-YUAN2 citations60