Inventor
MICHNA VINCENT W
US16 patents
⚠️ This page may combine multiple inventors who share the name “MICHNA VINCENT W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD ENTPR DEV LP
15 patentsUS10888031B2Jan 5, 2021
Memory device with memory modules located within liquid coolant chamber
HEWLETT PACKARD ENTPR DEV LP7 citations83
US11709529B2Jul 25, 2023
Variable enhanced processor performance
HEWLETT PACKARD ENTPR DEV LP4 citations70
US11593052B1Feb 28, 2023
Keyboard/video/monitor switch for servers without integrated video controller
HEWLETT PACKARD ENTPR DEV LP4 citations66
US10881017B2Dec 29, 2020
Backplane keying mechanism
HEWLETT PACKARD ENTPR DEV LP2 citations62
US11289857B2Mar 29, 2022
Electrical connector with integrated current sensor
HEWLETT PACKARD ENTPR DEV LP0 citations60
US12035068B2Jul 9, 2024
Providing video content for pre-boot and post-boot environments of computer platforms
HEWLETT PACKARD ENTPR DEV LP0 citations59
US12111706B2Oct 8, 2024
Variable enhanced processor performance
HEWLETT PACKARD ENTPR DEV LP0 citations58
US11251603B2Feb 15, 2022
Power backplane with distributed hotspot detection grid
HEWLETT PACKARD ENTPR DEV LP0 citations56
US12004317B2Jun 4, 2024
Computing system having a flexible filter assembly
HEWLETT PACKARD ENTPR DEV LP0 citations51
US11644879B2May 9, 2023
Power control system for a modular server enclosure
HEWLETT PACKARD ENTPR DEV LP0 citations49
US10716233B2Jul 14, 2020
Server
HEWLETT PACKARD ENTPR DEV LP0 citations49
US10838907B2Nov 17, 2020
Matching data I/O types on backplane systems
HEWLETT PACKARD ENTPR DEV LP0 citations48
US12068554B2Aug 20, 2024
Dual-path high-speed interconnect PCB layout solution
HEWLETT PACKARD ENTPR DEV LP0 citations47
US10520530B2Dec 31, 2019
Power sense output
HEWLETT PACKARD ENTPR DEV LP0 citations46
US11853134B2Dec 26, 2023
Fluid cooling assembly for a computing system
HEWLETT PACKARD ENTPR DEV LP0 citations43