Inventor
INAMASU TOSHIFUMI
JP14 patents
⚠️ This page may combine multiple inventors who share the name “INAMASU TOSHIFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
13 patentsUS7908995B2Mar 22, 2011
Stage apparatus and application processing apparatus
TOKYO ELECTRON LTD43 citations92
US7905195B2Mar 15, 2011
Floating-type substrate conveying and processing apparatus
TOKYO ELECTRON LTD34 citations91
US11348791B2May 31, 2022
Bonding apparatus and bonding method
TOKYO ELECTRON LTD3 citations71
US11094667B2Aug 17, 2021
Bonding apparatus, bonding system, bonding method, and recording medium
TOKYO ELECTRON LTD3 citations71
US10373847B2Aug 6, 2019
Bonding apparatus
TOKYO ELECTRON LTD2 citations71
US10340248B2Jul 2, 2019
Bonding systems
TOKYO ELECTRON LTD4 citations71
US9468946B2Oct 18, 2016
Wiping pad, and nozzle maintenance apparatus and coating treatment apparatus using wiping pad
TOKYO ELECTRON LTD5 citations71
US12381083B2Aug 5, 2025
Bonding apparatus and bonding method
TOKYO ELECTRON LTD0 citations61
US11658146B2May 23, 2023
Bonding apparatus, bonding system, bonding method, and recording medium
TOKYO ELECTRON LTD0 citations60
US11804466B2Oct 31, 2023
Substrate processing apparatus, substrate processing method and bonding method
TOKYO ELECTRON LTD0 citations50
US12538825B2Jan 27, 2026
Bonding apparatus, bonding system, and bonding method
TOKYO ELECTRON LTD0 citations49
US11545383B2Jan 3, 2023
Substrate positioning apparatus, substrate positioning method, and bonding apparatus
TOKYO ELECTRON LTD0 citations49
US12308294B2May 20, 2025
Bonding apparatus and bonding method
TOKYO ELECTRON LTD0 citations46