Inventor

REENTS BERT

DE7 patents

⚠️ This page may combine multiple inventors who share the name “REENTS BERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ATOTECH DEUTSCHLAND GMBH & CO KG

3 patents

US12439528B2Oct 7, 2025

Method of preparing a high density interconnect printed circuit board including microvias filled with copper

ATOTECH DEUTSCHLAND GMBH & CO KG0 citations51

US12245383B2Mar 4, 2025

Method of preparing a high density interconnect printed circuit board including microvias filled with copper

ATOTECH DEUTSCHLAND GMBH & CO KG0 citations51

US12063751B2Aug 13, 2024

Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board

ATOTECH DEUTSCHLAND GMBH & CO KG0 citations44

REENTS BERT

2 patents

US8784634B2Jul 22, 2014

Electrolytic method for filling holes and cavities with metals

REENTS BERT5 citations62

US9445510B2Sep 13, 2016

Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

REENTS BERT2 citations52

ATOTECH DEUTSCHLAND GMBH

2 patents

US9526183B2Dec 20, 2016

Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

ATOTECH DEUTSCHLAND GMBH0 citations44

US7767065B2Aug 3, 2010

Device and method for electrolytically treating an at least superficially electrically conducting work piece

ATOTECH DEUTSCHLAND GMBH0 citations41