Inventor

KIM SOUNGSOO

DE5 patents

⚠️ This page may combine multiple inventors who share the name “KIM SOUNGSOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

REENTS BERT

2 patents

US8784634B2Jul 22, 2014

Electrolytic method for filling holes and cavities with metals

REENTS BERT5 citations62

US9445510B2Sep 13, 2016

Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

REENTS BERT2 citations52

ATOTECH DEUTSCHLAND GMBH & CO KG

2 patents

US12439528B2Oct 7, 2025

Method of preparing a high density interconnect printed circuit board including microvias filled with copper

ATOTECH DEUTSCHLAND GMBH & CO KG0 citations51

US12245383B2Mar 4, 2025

Method of preparing a high density interconnect printed circuit board including microvias filled with copper

ATOTECH DEUTSCHLAND GMBH & CO KG0 citations51

ATOTECH DEUTSCHLAND GMBH

1 patent

US9526183B2Dec 20, 2016

Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

ATOTECH DEUTSCHLAND GMBH0 citations44