P

Inventor

COHEN URI

US52 patents
⚠️ This page may combine multiple inventors who share the name “COHEN URI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COHEN URI

21 patents
US7199052B2Apr 3, 2007

Seed layers for metallic interconnects

COHEN URI34 citations96
US7105434B2Sep 12, 2006

Advanced seed layery for metallic interconnects

COHEN URI23 citations93
US4923574AMay 8, 1990

Method for making a record member with a metallic antifriction overcoat

COHEN URI33 citations93
US6635184B1Oct 21, 2003

Method for pattern-etching alumina layers and products

COHEN URI28 citations92
US7709958B2May 4, 2010

Methods and structures for interconnect passivation

COHEN URI12 citations84
US7682496B2Mar 23, 2010

Apparatus for depositing seed layers

COHEN URI5 citations74
US7282445B2Oct 16, 2007

Multiple seed layers for interconnects

COHEN URI6 citations74
US4142947AMar 6, 1979

Electrodeposition of polycrystalline silicon from a molten fluoride bath and product

COHEN URI13 citations74
US8685221B1Apr 1, 2014

Enhanced electrochemical deposition filling

COHEN URI2 citations63
US8123861B2Feb 28, 2012

Apparatus for making interconnect seed layers and products

COHEN URI1 citations63
US7573133B2Aug 11, 2009

Interconnect structures and methods for their fabrication

COHEN URI5 citations63
US4678722AJul 7, 1987

Record member with metallic antifriction overcoat

COHEN URI6 citations63
US8603242B2Dec 10, 2013

Floating semiconductor foils

COHEN URI3 citations62
US10096547B2Oct 9, 2018

Metallic interconnects products

COHEN URI0 citations52
US9911614B2Mar 6, 2018

Methods for activating openings for jets electroplating

COHEN URI1 citations52
US9673090B2Jun 6, 2017

Seed layers for metallic interconnects

COHEN URI0 citations52
US9530653B2Dec 27, 2016

High speed electroplating metallic conductors

COHEN URI0 citations52
US9273409B2Mar 1, 2016

Electroplated metallic conductors

COHEN URI0 citations52
US8586471B2Nov 19, 2013

Seed layers for metallic interconnects and products

COHEN URI0 citations52
US8349149B2Jan 8, 2013

Apparatus for enhanced electrochemical deposition

COHEN URI0 citations52
US7550386B2Jun 23, 2009

Advanced seed layers for interconnects

COHEN URI0 citations52

(unassigned)

13 patents

SEAGATE TECHNOLOGY

10 patents

TOROHEAD INC

2 patents

VELOCIDATA INC

1 patent

MOTOROLA SOLUTIONS INC

1 patent

UNIV LELAND STANFORD JUNIOR

1 patent

BELL TELEPHONE LABOR INC

1 patent

Showing the top 50 of 52 patents by PatentIndex Score.