Inventor
MACHII YOUITI
JP2 patents
Patents
2 patentsUS8002860B2Aug 23, 2011
CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive
HITACHI CHEMICAL CO LTD12 citations81
US7410409B1Aug 12, 2008
Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound
HITACHI CHEMICAL CO LTD9 citations81