Inventor

SAKEMI SHOJI

JP28 patents

⚠️ This page may combine multiple inventors who share the name “SAKEMI SHOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAKEMI SHOJI

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Semiconductor device and method of manufacturing the same

Method for surface treatment of silicon based substrate

Method of mounting an electronic part with bumps on a circuit board

Method of manufacturing an electronic component

Apparatus and method for mounting soldering balls onto surfaces of electronic components

Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component

Method for forming bump electrode

Semiconductor device with reinforcing resin layer

Apparatus and method for mounting electrically conductive balls

Method of transferring conductive balls

Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps

Conductive ball mounting apparatus

Structure of electronic parts and method of soldering electronic parts to substrate

Apparatus and method for mounting soldering balls onto surfaces of electronic components

Method of mounting electronic connector on an end of printed circuit board

Method of soldering an electronic connector on a printed circuit board

Method of securely mounting conductive balls

Method for mounting conductive balls on a substrate

Method of solder pre-coating and solder pre-coated circuit board

Method for bonding electronic components

Electronic device mounting method

Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Plasma processing method

Semiconductor device and semiconductor device assembly

Method of automatically mounting electronic connector onto an end of printed circuit board

SAKEMI SHOJI

Electronic component mounting method and electronic component mount structure

KROSAKI HARIMA CORP

Electrode member used in a plasma treating apparatus