Inventor
BURNS DAVID W
US49 patents
⚠️ This page may combine multiple inventors who share the name “BURNS DAVID W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HONEYWELL INC
13 patentsUS5485753AJan 23, 1996
Piezoresistive silicon pressure sensor implementing long diaphragms with large aspect ratios
HONEYWELL INC136 citations99
US5559358ASep 24, 1996
Opto-electro-mechanical device or filter, process for making, and sensors made therefrom
HONEYWELL INC532 citations98
US5417115AMay 23, 1995
Dielectrically isolated resonant microsensors
HONEYWELL INC120 citations98
US5808210ASep 15, 1998
Thin film resonant microbeam absolute pressure sensor
HONEYWELL INC90 citations96
US5772322AJun 30, 1998
Resonant microbeam temperature sensor
HONEYWELL INC66 citations96
US5747705AMay 5, 1998
Method for making a thin film resonant microbeam absolute
HONEYWELL INC64 citations96
US5714690AFeb 3, 1998
Piezoresistive silicon pressure sensor manufacture implementing long diaphragms with large aspect ratios
HONEYWELL INC55 citations96
US5550516AAug 27, 1996
Integrated resonant microbeam sensor and transistor oscillator
HONEYWELL INC57 citations96
US5511427AApr 30, 1996
Cantilevered microbeam temperature sensor
HONEYWELL INC58 citations96
US5458000AOct 17, 1995
Static pressure compensation of resonant integrated microbeam sensors
HONEYWELL INC74 citations96
US5780742AJul 14, 1998
Mechanical resonance, silicon accelerometer
HONEYWELL INC61 citations95
US5683594ANov 4, 1997
Method for making diaphragm-based sensors and apparatus constructed therewith
HONEYWELL INC53 citations94
US5275055AJan 4, 1994
Resonant gauge with microbeam driven in constant electric field
HONEYWELL INC88 citations94
INTEL CORP
9 patentsUS7454600B2Nov 18, 2008
Method and apparatus for assigning thread priority in a processor or the like
INTEL CORP12 citations93
US6651158B2Nov 18, 2003
Determination of approaching instruction starvation of threads based on a plurality of conditions
INTEL CORP39 citations93
US7010669B2Mar 7, 2006
Determining whether thread fetch operation will be blocked due to processing of another thread
INTEL CORP13 citations84
US7748001B2Jun 29, 2010
Multi-thread processing system for detecting and handling live-lock conditions by arbitrating livelock priority of logical processors based on a predertermined amount of time
INTEL CORP15 citations83
US7877583B2Jan 25, 2011
Method and apparatus for assigning thread priority in a processor or the like
INTEL CORP0 citations52
US9626194B2Apr 18, 2017
Thread livelock unit
INTEL CORP0 citations51
US10678712B2Jun 9, 2020
Method and apparatus for bus lock assistance
INTEL CORP0 citations49
US10216650B2Feb 26, 2019
Method and apparatus for bus lock assistance
INTEL CORP0 citations49
US9880948B2Jan 30, 2018
Method and apparatus for bus lock assistance
INTEL CORP0 citations49
BURNS DAVID W
9 patentsUS7499604B1Mar 3, 2009
Optically coupled resonant pressure sensor and process
BURNS DAVID W35 citations92
US7379629B1May 27, 2008
Optically coupled resonant pressure sensor
BURNS DAVID W30 citations92
US7605391B2Oct 20, 2009
Optically coupled resonator
BURNS DAVID W12 citations84
US7443509B1Oct 28, 2008
Optical and electronic interface for optically coupled resonators
BURNS DAVID W16 citations84
US7176048B1Feb 13, 2007
Optically coupled sealed-cavity resonator and process
BURNS DAVID W10 citations84
USD271728SDec 13, 1983
Rocking chair
BURNS DAVID W19 citations82
USD291034SJul 28, 1987
Rocking chair
BURNS DAVID W16 citations74
US8276149B2Sep 25, 2012
Thread livelock reduction unit
BURNS DAVID W3 citations61
US8850165B2Sep 30, 2014
Method and apparatus for assigning thread priority in a processor or the like
BURNS DAVID W0 citations52
MAXIM INTEGRATED PRODUCTS
6 patentsUS6351996B1Mar 5, 2002
Hermetic packaging for semiconductor pressure sensors
MAXIM INTEGRATED PRODUCTS144 citations99
US6229190B1May 8, 2001
Compensated semiconductor pressure sensor
MAXIM INTEGRATED PRODUCTS201 citations99
US6346742B1Feb 12, 2002
Chip-scale packaged pressure sensor
MAXIM INTEGRATED PRODUCTS97 citations98
US6255728B1Jul 3, 2001
Rigid encapsulation package for semiconductor devices
MAXIM INTEGRATED PRODUCTS114 citations98
US6006607ADec 28, 1999
Piezoresistive pressure sensor with sculpted diaphragm
MAXIM INTEGRATED PRODUCTS93 citations97
US6147397ANov 14, 2000
Stress isolated integrated circuit and method for making
MAXIM INTEGRATED PRODUCTS21 citations93
WISCONSIN ALUMNI RES FOUND
4 patentsUS4897360AJan 30, 1990
Polysilicon thin film process
WISCONSIN ALUMNI RES FOUND216 citations99
US4744863AMay 17, 1988
Sealed cavity semiconductor pressure transducers and method of producing the same
WISCONSIN ALUMNI RES FOUND189 citations99
US4996082AFeb 26, 1991
Sealed cavity semiconductor pressure transducers and method of producing the same
WISCONSIN ALUMNI RES FOUND128 citations98
US4853669AAug 1, 1989
Sealed cavity semiconductor pressure transducers and method of producing the same
WISCONSIN ALUMNI RES FOUND131 citations98
HONEYWELL INT INC
3 patentsUS6557419B1May 6, 2003
Zero TCF thin film resonator
HONEYWELL INT INC89 citations98
US6246638B1Jun 12, 2001
Fiber-optic vibration sensor based on frequency modulation of light-excited oscillators
HONEYWELL INT INC63 citations96
US6763723B1Jul 20, 2004
Fiber-optic vibration sensor based on frequency modulation of light-excited oscillators
HONEYWELL INT INC24 citations92