P

Inventor

ISHII TOSHIAKI

JP78 patents
⚠️ This page may combine multiple inventors who share the name “ISHII TOSHIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

18 patents
US6028364AFeb 22, 2000

Semiconductor device having a stress relieving mechanism

HITACHI LTD167 citations98
US6114005ASep 5, 2000

Laminate and multilayer printed circuit board

HITACHI LTD98 citations97
US6282352B1Aug 28, 2001

Optical module, method for manufacturing optical module and optical communication apparatus

HITACHI LTD49 citations96
US6220764B1Apr 24, 2001

Optical module, method for manufacturing optical module and optical communication apparatus

HITACHI LTD78 citations96
US5677045AOct 14, 1997

Laminate and multilayer printed circuit board

HITACHI LTD86 citations96
US6457877B2Oct 1, 2002

Optical module, method for manufacturing optical module and optical communication apparatus

HITACHI LTD42 citations95
US6097100AAug 1, 2000

Resin sealed semiconductor devices and a process for manufacturing the same

HITACHI LTD56 citations94
US7504720B2Mar 17, 2009

Semiconductor unit, and power conversion system and on-vehicle electrical system using the same

HITACHI LTD38 citations93
US6726375B2Apr 27, 2004

Optical module, method for manufacturing optical module and optical communication apparatus

HITACHI LTD21 citations92
US6433440B1Aug 13, 2002

Semiconductor device having a porous buffer layer for semiconductor device

HITACHI LTD24 citations92
US6423571B2Jul 23, 2002

Method of making a semiconductor device having a stress relieving mechanism

HITACHI LTD35 citations92
US7955411B2Jun 7, 2011

Low temperature bonding material comprising metal particles and bonding method

HITACHI LTD13 citations84
US7816786B2Oct 19, 2010

Semiconductor unit, and power conversion system and on-vehicle electrical system using the same

HITACHI LTD12 citations84
US7608917B2Oct 27, 2009

Power semiconductor module

HITACHI LTD15 citations83
US6878448B2Apr 12, 2005

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

HITACHI LTD6 citations74
US7165898B2Jan 23, 2007

Optical module, method for manufacturing optical module and optical communication apparatus

HITACHI LTD7 citations73
US7671462B2Mar 2, 2010

Power semiconductor device

HITACHI LTD3 citations63
US7514780B2Apr 7, 2009

Power semiconductor device

HITACHI LTD5 citations63

MITSUBISHI ELECTRIC CORP

12 patents

HITACHI AUTOMOTIVE SYSTEMS LTD

6 patents

MIKUNI KOGYO KK

3 patents

SNOW BRAND MILK PRODUCTS CO LTD

2 patents

ORIENTAL YEAST CO LTD

1 patent

KUBOTA LTD

1 patent

RENESAS TECH CORP

1 patent

ISHII TOSHIAKI

1 patent

IDE EIICHI

1 patent

KAJIWARA RYOICHI

1 patent

SHARP KK

1 patent

YASUDA YUSUKE

1 patent

EBARA CORP

1 patent

Showing the top 50 of 78 patents by PatentIndex Score.