Inventor

NAGAI AKIRA

JP129 patents

⚠️ This page may combine multiple inventors who share the name “NAGAI AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAGAI AKIRA

HITACHI LTD

Semiconductor module and method of mounting

Semiconductor device having a stress relieving mechanism

Laminate and multilayer printed circuit board

Semiconductor apparatus having stress cushioning layer

Laminate and multilayer printed circuit board

Circuit board and process for producing the same

Composite article comprising a copper element and a process for producing it

Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same

Resin sealed semiconductor devices and a process for manufacturing the same

Semiconductor module and mounting method for same

Semiconductor device

Semiconductor device

Thermal stable low elastic modulus material and device using the same

Semiconductor device with elastic structure and wiring

Semiconductor device having a porous buffer layer for semiconductor device

Method of making a semiconductor device having a stress relieving mechanism

Semiconductor device and method for manufacturing the same technical field

Semiconductor apparatus and a manufacturing method thereof

Semiconductor device with chip size package

Method for producing thin film multilayer wiring board

Printed circuit board and method and apparatus for making same

Electronic device using low dielectric loss tangent insulators for high frequency signals

Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

HITACHI CHEMICAL CO LTD

Method of production of semiconductor device

Filmy adhesive for connecting circuits and circuit board

Electronic component parts device

Adhesive for bonding circuit members, circuit board, and method of producing the same

Adhesive for connection of circuit member and semiconductor device using the same

Production method of semiconductor device and bonding film

Adhesive for bonding circuit members, circuit board and process for its production

HONDA MOTOR CO LTD

Remote control system for a vehicle

Remote control system for a vehicle door

Anti-theft apparatus which permits the engine to start prior to ID signal discrimination

Vehicle anti-theft device

Electronic key system for a vehicle

RENESAS TECH CORP

Semiconductor module and mounting method for same

Integrated circuit device having reduced substrate size and a method for manufacturing the same

Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device

Semiconductor device comprising stress relaxation layers and method for manufacturing the same

MITSUI HIGH TEC

Laminated core and method for manufacturing the same

Laminated core and method for manufacturing the same

Laminated core and method for manufacturing the same

NAGAI AKIRA

Rotor core

Method for manufacturing laminated core and laminated core

Method of manufacturing laminated rotor core

KOKUSAI DENSHIN DENWA CO LTD

Optical submarine cable connection

UNIV KYOTO

Fiber-reinforced composite material, method for manufacturing the same and applications thereof

HONDALOCK MFG CO LTD

Remote control system for a vehicle

MATSUBAYASHI SATOSHI

Method of manufacturing laminated core having permanent magnets sealed with resin