Inventor
SEGAWA MASANORI
JP36 patents
⚠️ This page may combine multiple inventors who share the name “SEGAWA MASANORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
30 patentsUS5068712ANov 26, 1991
Semiconductor device
HITACHI LTD165 citations99
US6028364AFeb 22, 2000
Semiconductor device having a stress relieving mechanism
HITACHI LTD167 citations98
US6114005ASep 5, 2000
Laminate and multilayer printed circuit board
HITACHI LTD98 citations97
US6081023AJun 27, 2000
Semiconductor device
HITACHI LTD28 citations96
US5793099AAug 11, 1998
Semiconductor device
HITACHI LTD30 citations96
US5677045AOct 14, 1997
Laminate and multilayer printed circuit board
HITACHI LTD86 citations96
US5612569AMar 18, 1997
Semiconductor device
HITACHI LTD35 citations96
US5530286AJun 25, 1996
Semiconductor device
HITACHI LTD53 citations96
US5358904AOct 25, 1994
Semiconductor device
HITACHI LTD47 citations96
US6114753ASep 5, 2000
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
HITACHI LTD50 citations95
US6097100AAug 1, 2000
Resin sealed semiconductor devices and a process for manufacturing the same
HITACHI LTD56 citations94
US6130114AOct 10, 2000
Semiconductor device
HITACHI LTD17 citations93
US6100580AAug 8, 2000
Semiconductor device having all outer leads extending from one side of a resin member
HITACHI LTD17 citations93
US6018191AJan 25, 2000
Semiconductor device
HITACHI LTD18 citations93
US6433440B1Aug 13, 2002
Semiconductor device having a porous buffer layer for semiconductor device
HITACHI LTD24 citations92
US6423571B2Jul 23, 2002
Method of making a semiconductor device having a stress relieving mechanism
HITACHI LTD35 citations92
US6791194B1Sep 14, 2004
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
HITACHI LTD18 citations83
US6326681B1Dec 4, 2001
Semiconductor device
HITACHI LTD14 citations82
US6303982B2Oct 16, 2001
Semiconductor device
HITACHI LTD10 citations82
US6072231AJun 6, 2000
Semiconductor device
HITACHI LTD12 citations82
US6069029AMay 30, 2000
Semiconductor device chip on lead and lead on chip manufacturing
HITACHI LTD13 citations82
US5981315ANov 9, 1999
Semiconductor device
HITACHI LTD7 citations82
US5914530AJun 22, 1999
Semiconductor device
HITACHI LTD15 citations82
US5863817AJan 26, 1999
Semiconductor device
HITACHI LTD7 citations82
US5821606AOct 13, 1998
Semiconductor device
HITACHI LTD9 citations82
US5181097AJan 19, 1993
Plastic molded type electronic device
HITACHI LTD19 citations80
US6124629ASep 26, 2000
Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip
HITACHI LTD3 citations74
US5225499AJul 6, 1993
Resin composition for encapsulating of semiconductor and semiconductor apparatus using of the same
HITACHI LTD8 citations74
US6100115AAug 8, 2000
Semiconductor device
HITACHI LTD1 citations63
US6204552B1Mar 20, 2001
Semiconductor device
HITACHI LTD0 citations52
RENESAS TECH CORP
4 patentsUS6720208B2Apr 13, 2004
Semiconductor device
RENESAS TECH CORP2 citations74
US7202570B2Apr 10, 2007
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same
RENESAS TECH CORP6 citations73
US7038325B2May 2, 2006
Wiring tape for semiconductor device including a buffer layer having interconnected foams
RENESAS TECH CORP3 citations63
US6919622B2Jul 19, 2005
Semiconductor device
RENESAS TECH CORP0 citations52