Inventor

UENO TAKUMI

JP37 patents

⚠️ This page may combine multiple inventors who share the name “UENO TAKUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UENO TAKUMI

HITACHI LTD

Semiconductor module and method of mounting

Resin sealed semiconductor devices and a process for manufacturing the same

High dielectric constant composite material and multilayer wiring board using the same

Semiconductor module and mounting method for same

Thermal stable low elastic modulus material and device using the same

Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member

Semiconductor device having a porous buffer layer for semiconductor device

Semiconductor device and method for manufacturing the same technical field

Semiconductor apparatus and a manufacturing method thereof

Radiation-sensitive resist composition with an admixture of cis-(1,3,5,7-tetrahydroxy)-1,3,5,7-tetraphenylcyclotetrasiloxane and a polysilsesquioxane

Positive photosensitive resin composition and electronic apparatus using the same

Method of forming pattern and making semiconductor device using radiation-induced conductive resin bottom resist layer

Resist pattern forming process with dry etching

Pattern forming material and process for forming pattern using the same

High dielectric constant composite material and multilayer wiring board using the same

Radiation imaging process for forming pattern without alkali-soluble polymer underlayer and water soluble radiation-sensitive diazonium salt overlayer

Pattern-formation method with iodine containing azide and oxygen plasma etching of substrate

Thermal stable low elastic modulus material and device using the same

Pattern forming material and process for forming pattern using the same

RENESAS TECH CORP

Semiconductor module and mounting method for same

Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device

Semiconductor devices

Semiconductor device comprising stress relaxation layers and method for manufacturing the same

Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device

Wiring tape for semiconductor device including a buffer layer having interconnected foams

MATSUTANI HIROSHI

Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component

Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device

Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device

HITACHI CHEM DUPONT MICROSYS

Photosensitive polymer composition, method of forming relief patterns, and electronic equipment

Photosensitive polymer composition, method of forming relief patterns, and electronic equipment

OOE MASAYUKI

Photosensitive polymer composition, method of producing pattern and electronic parts

Photosensitive polymer composition, method of producing pattern and electronic parts

HITICHI LTD

Method of forming a pattern

HITACHI CHEMICAL CO LTD

Photosensitive resin composition, method for forming pattern therefrom, electronic devices produced by using the same, and method for production thereof

NAKANO HAJIME

Positive-type photosensitive resin composition, method for producing patterns, and electronic parts

NUNOMURA MASATAKA

Photosensitive polymer composition, method of forming relief patterns, and electronic equipment

TANIMOTO AKITOSHI

Positive photosensitive resin composition, method of creating resist pattern, and electronic component