P

Inventor

HIGASHIKAWA IWAO

JP28 patents
⚠️ This page may combine multiple inventors who share the name “HIGASHIKAWA IWAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOSHIBA KK

24 patents
US6333138B1Dec 25, 2001

Exposure method utilizing partial exposure stitch area

TOSHIBA KK76 citations96
US5969428AOct 19, 1999

Alignment mark, manufacturing method thereof, exposing method using the alignment mark, semiconductor device manufactured using the exposing method

TOSHIBA KK43 citations96
US5847468ADec 8, 1998

Alignment mark for use in making semiconductor devices

TOSHIBA KK43 citations96
US5851842ADec 22, 1998

Measurement system and measurement method

TOSHIBA KK86 citations94
US6765673B1Jul 20, 2004

Pattern forming method and light exposure apparatus

TOSHIBA KK42 citations92
US6340542B1Jan 22, 2002

Method of manufacturing a semiconductor device, method of manufacturing a photomask, and a master mask

TOSHIBA KK36 citations92
US6333493B1Dec 25, 2001

Heat treating method and heat treating apparatus

TOSHIBA KK20 citations92
US6265696B1Jul 24, 2001

Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surface

TOSHIBA KK21 citations92
US5907393AMay 25, 1999

Exposure mask and method and apparatus for manufacturing the same

TOSHIBA KK32 citations92
US5767521AJun 16, 1998

Electron-beam lithography system and method for drawing nanometer-order pattern

TOSHIBA KK68 citations92
US5728494AMar 17, 1998

Exposure mask and method and apparatus for manufacturing the same

TOSHIBA KK26 citations92
US5629115AMay 13, 1997

Exposure mask and method and apparatus for manufacturing the same

TOSHIBA KK33 citations92
US6040114AMar 21, 2000

Pattern forming method

TOSHIBA KK12 citations81
US6635549B2Oct 21, 2003

Method of producing exposure mask

TOSHIBA KK11 citations74
US6483083B2Nov 19, 2002

Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surface

TOSHIBA KK7 citations74
US6319637B1Nov 20, 2001

Method for forming pattern

TOSHIBA KK10 citations74
US5262282ANov 16, 1993

Pattern forming method

TOSHIBA KK7 citations74
US4510173AApr 9, 1985

Method for forming flattened film

TOSHIBA KK14 citations74
US6680462B2Jan 20, 2004

Heat treating method and heat treating apparatus

TOSHIBA KK4 citations63
US6542237B1Apr 1, 2003

Exposure method for making precision patterns on a substrate

TOSHIBA KK5 citations63
US6495807B2Dec 17, 2002

Heat treating method and heat treating apparatus

TOSHIBA KK3 citations63
US6165652ADec 26, 2000

Pattern forming method and pattern forming apparatus

TOSHIBA KK3 citations62
US6806941B2Oct 19, 2004

Pattern forming method and pattern forming apparatus

TOSHIBA KK0 citations51
US6335145B1Jan 1, 2002

Pattern forming method and pattern forming apparatus

TOSHIBA KK0 citations51

SORTEC CORP

2 patents

TOKYO SHIBAURA ELECTRIC CO

1 patent

VLSI TECHNOLOGY RES ASS

1 patent