Inventor
SCHNEIDER GERHARD M
US4 patents
Patents
4 patentsUS6962644B2Nov 8, 2005
Tandem etch chamber plasma processing system
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US6364957B1Apr 2, 2002
Support assembly with thermal expansion compensation
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US6220607B1Apr 24, 2001
Thermally conductive conformal media
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US7552736B2Jun 30, 2009
Process for wafer backside polymer removal with a ring of plasma under the wafer
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