Inventor

MORRIS TERREL L

US52 patents

⚠️ This page may combine multiple inventors who share the name “MORRIS TERREL L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MORRIS TERREL L

HEWLETT PACKARD DEVELOPMENT CO

Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump

Systems and methods that use at least one component to remove the heat generated by at least one other component

Apparatus and method of providing separate control and data channels between arrays of light emitters and detectors for optical communication and alignment

Optical connections and methods of forming optical connections

Systems and methods that use at least one component to remove the heat generated by at least one other component

Apparatus and method of establishing optical communication channels between a steerable array of laser emitters and an array of optical detectors

System and method of configuring fiber optic communication channels between arrays of emitters and detectors

Apparatus for providing optical communication between integrated circuits of different PC boards and an integrated circuit assembly for use therein

System and method of self-configuring optical communication channels between arrays of emitters and detectors

Method and apparatus of disabling converters in a power module

Power module for a plurality of processors

Method for providing flexible circuit using discrete wiring

Integrated VCSELs on traditional VLSI packaging

Integrated VCSELs on ASIC module using flexible electrical connections

Lossy RF shield for integrated circuits

Optical connections and methods of forming optical connections

Optical connections and methods of forming optical connections

Optical connections and methods of forming optical connections

Fiber optic module

Controllable optical ring resonator having periodically spaced control electrodes

Optical connections and methods of forming optical connections

Optical connections and methods of forming optical connections

Apparatus and method of providing an optical connection between PC boards for optical communication

Micro-electro-mechanical systems and photonic interconnects employing the same

Cable assembly

HEWLETT PACKARD CO

Packaging architecture for 32 processor server

Lossy RF shield for integrated circuits

Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump

IC die power connection using canted coil spring

Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump

Laminated 90-degree connector

AC coupled termination of a printed circuit board power plane in its characteristic impedance

Method and apparatus for reducing noise in integrated circuit chips

Method and apparatus for performing testing of double-sided ball grid array devices

Grounding clip for shielded modular connector

Bifurcated contact with a connecting member at the tip of the contact that provides redundant contact points

Backing plate for LGA mounting of integrated circuits facilitates probing of the IC&#39;s pins

Flexible circuit using discrete wiring

Connector with redundant contact points

Bifurcated contact with a connecting member that can add redundant contact points to single point connectors

Effective netlength calculation

IC die power connection using canted coil spring

HEWLETT PACKARD ENTPR DEV LP

Laser-written optical routing systems and method

Optical interconnect device

Laser-written optical routing systems and method

Modular apparatuses and system for backplane connections

Optical fiber interface for optical device package

Optical port-shuffling module

MORRIS TERREL L

Apparatus and method of establishing optical communication channels between a steerable array of laser emitters and an array of optical detectors

Optical architecture with riser cards a matrix and optic cables to carry outbound signals of the matrix to the riser cards

Backing plate for LGA mounting of integrated circuits facilitates probing of the IC's pins