Inventor
LEE SANG-HYEOP
KR9 patents
Patents
9 patentsUS6218260B1Apr 17, 2001
Methods of forming integrated circuit capacitors having improved electrode and dielectric layer characteristics and capacitors formed thereby
SAMSUNG ELECTRONICS CO LTD76 citations95
US6573168B2Jun 3, 2003
Methods for forming conductive contact body for integrated circuits using dummy dielectric layer
SAMSUNG ELECTRONICS CO LTD28 citations92
US7148080B2Dec 12, 2006
Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package
SAMSUNG ELECTRONICS CO LTD19 citations89
US5932923AAug 3, 1999
Semiconductor device packages having dummy block leads and tie bars with extended portions to prevent formation of air traps in the encapsulate
SAMSUNG ELECTRONICS CO LTD28 citations88
US6077573AJun 20, 2000
Plasma enhanced chemical vapor deposition methods of forming hemispherical grained silicon layers
SAMSUNG ELECTRONICS CO LTD18 citations84
US6624069B2Sep 23, 2003
Methods of forming integrated circuit capacitors having doped HSG electrodes
SAMSUNG ELECTRONICS CO LTD12 citations73
US6876029B2Apr 5, 2005
Integrated circuit capacitors having doped HSG electrodes
SAMSUNG ELECTRONICS CO LTD4 citations62
US7414303B2Aug 19, 2008
Lead on chip semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US7988873B2Aug 2, 2011
Method of forming a mask pattern for fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations49