Inventor

HUNG CHIH-PIN

TW59 patents

⚠️ This page may combine multiple inventors who share the name “HUNG CHIH-PIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUNG CHIH-PIN

ADVANCED SEMICONDUCTOR ENG

Semiconductor device packages with electromagnetic interference shielding

Semiconductor device packages with electromagnetic interference shielding

Semiconductor device packages and stacked package assemblies including high density interconnections

Semiconductor device packages with electromagnetic interference shielding

Semiconductor package with connector

MCM package with bridge connection

Flip chip package structure and flip chip device with area bump

Electronic package

Circuit substrate and fabrication method thereof

Stacked semiconductor package assemblies including double sided redistribution layers

Structure of wafer level package with area bump

Electronic device package and method for manufacturing the same

Semiconductor device packages and stacked package assemblies including high density interconnections

Semiconductor device packages and stacked package assemblies including high density interconnections

Package structure for connection with output/input module

Integrated circuit package substrate integrating with decoupling capacitor

Semiconductor device package having an underfill barrier

Multi-chip package with electrical interconnection

Electronic device package and method for manufacturing the same

Semiconductor package structure, semiconductor wafer level package and semiconductor manufacturing process

Inductor and capacitor formed of build-up vias

Electronic device package and method for manufacturing the same

Semiconductor device packages and methods of manufacturing the same

Semiconductor device packages and methods of manufacturing the same

Semiconductor device package and method for manufacturing the same

Semiconductor device packages and stacked package assemblies including high density interconnections

Semiconductor package device and method of manufacturing the same

Semiconductor device package

Semiconductor devices and semiconductor packages

Semiconductor device package and a method of manufacturing the same

Semiconductor packages

Package structure and method for manufacturing the same

Bridge connection type of chip package and fabricating method thereof

Bridge connection type of chip package and fabricating method thereof

Packaging substrate with electrostatic discharge protection

Electronic device

Semiconductor device package and method of manufacturing the same

Semiconductor device packages and methods of manufacturing the same

Power and ground design for through-silicon via structure

Carrier with embedded component and method for fabricating the same

Lead frame package structure with high density of lead pins arrangement

Semiconductor device packages and methods of manufacturing the same

Electronic device comprising heat pipe contacting a cover structure for heat dissipation

Substrate structure and semiconductor package structure

Package structure and method for manufacturing the same

Packaging mold with electrostatic discharge protection

LIAO KUO-HSIEN

Semiconductor device packages with electromagnetic interference shielding

Semiconductor device packages with electromagnetic interference shielding

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device and method of determining temperature of semiconductor device

Capacitor structure