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Inventor
IIMURA MITSUO
JP
2 patents
Patents
2 patents
US6284565B1
Sep 4, 2001
Method of resin-encapsulating semiconductor chip and mold-releasing film used for the method
NITTO DENKO CORP
10 citations
71
US6270879B1
Aug 7, 2001
Release member for use in producing a multi-layer printed wiring board
NITTO DENKO CORP
6 citations
60