Inventor
CREMA PAOLO
IT17 patents
⚠️ This page may combine multiple inventors who share the name “CREMA PAOLO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ST MICROELECTRONICS SRL
16 patentsUS6221696B1Apr 24, 2001
Process for improving the adhesion between metal and plastic in containment structures for electronic semiconductor devices
ST MICROELECTRONICS SRL28 citations86
US9822001B2Nov 21, 2017
Process for manufacturing a lid for an electronic device package, and lid for an electronic device package
ST MICROELECTRONICS SRL7 citations82
US5789279AAug 4, 1998
Method and apparatus for electrically insulating heat sinks in electronic power devices
ST MICROELECTRONICS SRL16 citations72
US10408952B2Sep 10, 2019
Radiation scintillator detector, detector package and manufacturing process thereof
ST MICROELECTRONICS SRL2 citations71
US6468356B1Oct 22, 2002
Method for removing molding residues in the fabrication of plastic packages for semiconductor devices
ST MICROELECTRONICS SRL12 citations71
US12125803B2Oct 22, 2024
Method of manufacturing semiconductor devices, corresponding apparatus and semiconductor device
ST MICROELECTRONICS SRL0 citations61
US11869832B2Jan 9, 2024
Leadframe package using selectively pre-plated leadframe
ST MICROELECTRONICS SRL0 citations61
US11640931B2May 2, 2023
Die attachment method and material between a semiconductor device and die pad of a leadframe
ST MICROELECTRONICS SRL0 citations61
US11610849B2Mar 21, 2023
Method of manufacturing semiconductor devices, corresponding apparatus and semiconductor device
ST MICROELECTRONICS SRL0 citations61
US6291893B1Sep 18, 2001
Power semiconductor device for “flip-chip” connections
ST MICROELECTRONICS SRL6 citations61
US11977190B2May 7, 2024
Scintillator radiation detector and corresponding dosimeter
ST MICROELECTRONICS SRL1 citations59
US11756899B2Sep 12, 2023
Lead frame surface finishing
ST MICROELECTRONICS SRL0 citations58
US12368055B2Jul 22, 2025
Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device
ST MICROELECTRONICS SRL0 citations51
US11948806B2Apr 2, 2024
Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device
ST MICROELECTRONICS SRL0 citations51
US10763195B2Sep 1, 2020
Leadframe package using selectively pre-plated leadframe
ST MICROELECTRONICS SRL0 citations51
US9461011B2Oct 4, 2016
Method and apparatus for manufacturing lead frames
ST MICROELECTRONICS SRL1 citations51