Inventor
UNO TOMOHIRO
JP88 patents
⚠️ This page may combine multiple inventors who share the name “UNO TOMOHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON MICROMETAL CORP
17 patentsUS10137534B2Nov 27, 2018
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP5 citations84
US9773748B2Sep 26, 2017
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP5 citations84
US9887172B2Feb 6, 2018
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP6 citations83
US10737356B2Aug 11, 2020
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP1 citations73
US10610976B2Apr 7, 2020
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP1 citations73
US10414002B2Sep 17, 2019
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP1 citations73
US9543266B2Jan 10, 2017
Bonding wire for semiconductor device use and method of production of same
NIPPON MICROMETAL CORP2 citations73
US12090578B2Sep 17, 2024
Al bonding wire
NIPPON MICROMETAL CORP2 citations72
US11373934B2Jun 28, 2022
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP4 citations72
US12581982B2Mar 17, 2026
Bonding wire for semiconductor devices
NIPPON MICROMETAL CORP0 citations62
US12532767B2Jan 20, 2026
Al bonding wire
NIPPON MICROMETAL CORP0 citations62
US12388044B2Aug 12, 2025
Al bonding wire
NIPPON MICROMETAL CORP0 citations62
US12300658B2May 13, 2025
Copper alloy bonding wire for semiconductor devices
NIPPON MICROMETAL CORP0 citations62
US12132025B2Oct 29, 2024
Bonding wire
NIPPON MICROMETAL CORP0 citations62
US10468370B2Nov 5, 2019
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP1 citations62
US12334467B2Jun 17, 2025
Copper bonding wire
NIPPON MICROMETAL CORP0 citations61
US12412864B2Sep 9, 2025
Bonding wire for semiconductor devices
NIPPON MICROMETAL CORP0 citations60
UNO TOMOHIRO
8 patentsUS8836147B2Sep 16, 2014
Bonding structure of multilayer copper bonding wire
UNO TOMOHIRO44 citations93
US8653668B2Feb 18, 2014
Copper bonding wire for semiconductor device and bonding structure thereof
UNO TOMOHIRO51 citations93
US8389860B2Mar 5, 2013
Bonding wire for semiconductor devices
UNO TOMOHIRO21 citations92
US8102061B2Jan 24, 2012
Semiconductor device bonding wire and wire bonding method
UNO TOMOHIRO6 citations83
US8610291B2Dec 17, 2013
Copper alloy bonding wire for semiconductor device
UNO TOMOHIRO3 citations63
US8299356B2Oct 30, 2012
Bonding wire for semiconductor devices
UNO TOMOHIRO4 citations63
US9331049B2May 3, 2016
Bonding structure of bonding wire
UNO TOMOHIRO2 citations62
US8247911B2Aug 21, 2012
Wire bonding structure and method for forming same
UNO TOMOHIRO4 citations62
NIPPON STEEL CHEMICAL & MAT CO LTD
6 patentsUS10381320B2Aug 13, 2019
Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium
NIPPON STEEL CHEMICAL & MAT CO LTD6 citations82
US11612966B2Mar 28, 2023
Ag alloy bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD2 citations70
US10991672B2Apr 27, 2021
Cu alloy bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD0 citations62
US10985130B2Apr 20, 2021
Cu alloy bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD0 citations62
US10950571B2Mar 16, 2021
Bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD0 citations62
US10840208B2Nov 17, 2020
Bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD1 citations62
NIPPON STEEL CORP
5 patentsUS5761779AJun 9, 1998
Method of producing fine metal spheres of uniform size
NIPPON STEEL CORP31 citations89
US7969021B2Jun 28, 2011
Bonding wire for semiconductor device and method for producing the same
NIPPON STEEL CORP12 citations84
US6210637B1Apr 3, 2001
Gold alloy thin wire for semiconductor devices
NIPPON STEEL CORP10 citations74
US7390370B2Jun 24, 2008
Gold bonding wires for semiconductor devices and method of producing the wires
NIPPON STEEL CORP6 citations73
US5658664AAug 19, 1997
Thin gold-alloy wire for semiconductor device
NIPPON STEEL CORP9 citations73
NIPPON STEEL MATERIALS CO LTD
4 patentsUS7952028B2May 31, 2011
Bonding wire for semiconductor device
NIPPON STEEL MATERIALS CO LTD25 citations92
US7820913B2Oct 26, 2010
Bonding wire for semiconductor device
NIPPON STEEL MATERIALS CO LTD34 citations92
US8004094B2Aug 23, 2011
Copper alloy bonding wire for semiconductor device
NIPPON STEEL MATERIALS CO LTD7 citations84
US7830008B2Nov 9, 2010
Gold wire for connecting semiconductor chip
NIPPON STEEL MATERIALS CO LTD2 citations63
SANDISK TECHNOLOGIES LLC
3 patentsUS10615123B2Apr 7, 2020
Three-dimensional memory device containing compositionally graded word line diffusion barrier layer for and methods of forming the same
SANDISK TECHNOLOGIES LLC11 citations85
US10121965B1Nov 6, 2018
Resistive random access memory device containing discrete memory material portions and method of making thereof
SANDISK TECHNOLOGIES LLC18 citations83
US11217532B2Jan 4, 2022
Three-dimensional memory device containing compositionally graded word line diffusion barrier layer for and methods of forming the same
SANDISK TECHNOLOGIES LLC4 citations73
FUJITSU LTD
2 patentsUS10789228B2Sep 29, 2020
Data presence/absence determination apparatus and computer-readable storage medium storing program for determination of data presence/absence
FUJITSU LTD2 citations70
US11429286B2Aug 30, 2022
Information processing apparatus and recording medium storing information processing program
FUJITSU LTD1 citations60
SEIKO EPSON CORP
2 patentsTERASHIMA SHINICHI
1 patentNIPPON STEEL & SUMIKIN MAT CO
1 patentNIPPON STEEL & SUMITOMO METAL CORP
1 patentShowing the top 50 of 88 patents by PatentIndex Score.