Inventor
NGUYEN DU BINH
US10 patents
Patents
10 patentsUS6130161AOct 10, 2000
Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity
IBM111 citations98
US6734090B2May 11, 2004
Method of making an edge seal for a semiconductor device
IBM605 citations97
US6133139AOct 17, 2000
Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof
IBM51 citations96
US6348731B1Feb 19, 2002
Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same
IBM77 citations95
US6287954B1Sep 11, 2001
Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity
IBM71 citations95
US7279411B2Oct 9, 2007
Process for forming a redundant structure
IBM23 citations92
US6294835B1Sep 25, 2001
Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof
IBM26 citations92
US5981374ANov 9, 1999
Sub-half-micron multi-level interconnection structure and process thereof
IBM37 citations92
US7163883B2Jan 16, 2007
Edge seal for a semiconductor device
IBM27 citations91
US5760595AJun 2, 1998
High temperature electromigration stress test system, test socket, and use thereof
IBM15 citations70