Inventor

LU SU-TSAI

TW28 patents

⚠️ This page may combine multiple inventors who share the name “LU SU-TSAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LU SU-TSAI

IND TECH RES INST

Bonding structure with buffer layer and method of forming the same

Chip structure and chip package structure

Conductive line structure and sensing device using the same

Touch structure and manufacturing method for the same

Mesh electrode, sensing device, and electrode layer

Touch panel and manufacturing method thereof and touch display panel

Gravure printing system and method of using the same

Illumination device

Electronic assembly having a multilayer adhesive structure

Wafer level package structure of optical-electronic device and method for making the same

Bonding structure with buffer layer and method of forming the same

Bonding structure of device packaging

Bonding structure with buffer layer and method of forming the same

Touch panel structure and fabrication method for the same

Electrode structure of memory capacitor

Bonding structure with buffer layer and method of forming the same

Illumination device

Wafer level molding structure

Wafer level package structure of optical-electronic device and method for making the same

Composite bump

Sensing structure

LU SU-TSAI

Chip stack structure and method for fabricating the same

Electronic assembly having a multilayer adhesive structure

CHEN WEN-HWA

Stacked capacitor structure and manufacturing method thereof

LU SU TSAI

Bump structure, chip package structure including the same and method of manufacturing the same

YANG TSUNG-FU

Sealed joint structure of device and process using the same

LIN YU-MIN

Semiconductor device and assembling method thereof

CHANG TAO-CHIH

Electronic device package structure with a hydrophilic protection layer and method for fabricating the same