Inventor
DUCHESNE ERIC
CA17 patents
⚠️ This page may combine multiple inventors who share the name “DUCHESNE ERIC”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
14 patentsUS6104093AAug 15, 2000
Thermally enhanced and mechanically balanced flip chip package and method of forming
IBM92 citations97
US6410988B1Jun 25, 2002
Thermally enhanced and mechanically balanced flip chip package and method of forming
IBM45 citations96
US6819566B1Nov 16, 2004
Grounding and thermal dissipation for integrated circuit packages
IBM34 citations92
US7740713B2Jun 22, 2010
Flux composition and techniques for use thereof
IBM17 citations83
US7176563B2Feb 13, 2007
Electronically grounded heat spreader
IBM7 citations73
US6984286B2Jan 10, 2006
Adjusting fillet geometry to couple a heat spreader to a chip carrier
IBM6 citations72
US6545869B2Apr 8, 2003
Adjusting fillet geometry to couple a heat spreader to a chip carrier
IBM8 citations72
US9818717B2Nov 14, 2017
Enhanced cleaning for water-soluble flux soldering
IBM2 citations68
US7484190B1Jan 27, 2009
Method to optimize the manufacturing of interconnects in microelectronic packages
IBM3 citations62
US7780801B2Aug 24, 2010
Flux composition and process for use thereof
IBM5 citations61
US10739209B2Aug 11, 2020
Carbon nanotube-based multi-sensor
IBM1 citations53
US7771541B2Aug 10, 2010
Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces
IBM0 citations49
US10636763B2Apr 28, 2020
Enhanced cleaning for water-soluble flux soldering
IBM0 citations47
US10564047B2Feb 18, 2020
Carbon nanotube-based multi-sensor
IBM0 citations42