Inventor
SYLVESTRE JULIEN
CA20 patents
⚠️ This page may combine multiple inventors who share the name “SYLVESTRE JULIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS9698072B2Jul 4, 2017
Low-stress dual underfill packaging
IBM8 citations83
US9287230B2Mar 15, 2016
Thermocompression for semiconductor chip assembly
IBM4 citations83
US7473618B1Jan 6, 2009
Temporary structure to reduce stress and warpage in a flip chip organic package
IBM14 citations83
US9761542B1Sep 12, 2017
Liquid metal flip chip devices
IBM13 citations74
US9373559B2Jun 21, 2016
Low-stress dual underfill packaging
IBM3 citations72
US8932909B2Jan 13, 2015
Thermocompression for semiconductor chip assembly
IBM2 citations62
US7538432B1May 26, 2009
Temporary structure to reduce stress and warpage in a flip chip organic package
IBM4 citations62
US7484190B1Jan 27, 2009
Method to optimize the manufacturing of interconnects in microelectronic packages
IBM3 citations62
US7482180B1Jan 27, 2009
Method for determining the impact of layer thicknesses on laminate warpage
IBM3 citations60
US10134704B2Nov 20, 2018
Thermocompression for semiconductor chip assembly
IBM0 citations51
US9735125B2Aug 15, 2017
Thermocompression for semiconductor chip assembly
IBM0 citations51
US8910853B2Dec 16, 2014
Additives for grain fragmentation in Pb-free Sn-based solder
IBM0 citations51
US7512518B2Mar 31, 2009
Method for measuring thin layers in solid state devices
IBM0 citations29