Inventor
HUMPSTON GILES
GB46 patents
⚠️ This page may combine multiple inventors who share the name “HUMPSTON GILES”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TESSERA INC
21 patentsUS7768574B2Aug 3, 2010
Compact lens turret assembly
TESSERA INC95 citations98
US7298030B2Nov 20, 2007
Structure and method of making sealed capped chips
TESSERA INC75 citations97
US7129576B2Oct 31, 2006
Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
TESSERA INC46 citations96
US7224056B2May 29, 2007
Back-face and edge interconnects for lidded package
TESSERA INC53 citations95
US7793414B2Sep 14, 2010
Methods for forming connection structures for microelectronic devices
TESSERA INC18 citations93
US7759166B2Jul 20, 2010
Microelectronic packages fabricated at the wafer level and methods therefor
TESSERA INC25 citations93
US7719121B2May 18, 2010
Microelectronic packages and methods therefor
TESSERA INC45 citations93
US7858445B2Dec 28, 2010
Wire bonded wafer level cavity package
TESSERA INC26 citations92
US7593636B2Sep 22, 2009
Pin referenced image sensor to reduce tilt in a camera module
TESSERA INC35 citations92
US7449779B2Nov 11, 2008
Wire bonded wafer level cavity package
TESSERA INC26 citations92
US7443597B2Oct 28, 2008
Liquid lens with piezoelectric voltage converter
TESSERA INC44 citations92
US7569424B2Aug 4, 2009
Method of forming a wall structure in a microelectronic assembly
TESSERA INC28 citations89
US7545029B2Jun 9, 2009
Stack microelectronic assemblies
TESSERA INC13 citations84
US7485956B2Feb 3, 2009
Microelectronic package optionally having differing cover and device thermal expansivities
TESSERA INC19 citations84
US7317249B2Jan 8, 2008
Microelectronic package having stacked semiconductor devices and a process for its fabrication
TESSERA INC15 citations84
US7262368B2Aug 28, 2007
Connection structures for microelectronic devices and methods for forming such structures
TESSERA INC10 citations84
US7510401B2Mar 31, 2009
Microelectronic component with foam-metal posts
TESSERA INC6 citations61
US8883562B2Nov 11, 2014
Reconstituted wafer stack packaging with after-applied pad extensions
TESSERA INC0 citations52
US7521276B2Apr 21, 2009
Compliant terminal mountings with vented spaces and methods
TESSERA INC0 citations52
US7453139B2Nov 18, 2008
Compliant terminal mountings with vented spaces and methods
TESSERA INC0 citations52
US7157309B2Jan 2, 2007
Manufacture of microelectronic fold packages
TESSERA INC0 citations52
HABA BELGACEM
5 patentsUS8207604B2Jun 26, 2012
Microelectronic package comprising offset conductive posts on compliant layer
HABA BELGACEM93 citations98
US8193615B2Jun 5, 2012
Semiconductor packaging process using through silicon vias
HABA BELGACEM42 citations94
US8461672B2Jun 11, 2013
Reconstituted wafer stack packaging with after-applied pad extensions
HABA BELGACEM27 citations92
US8735287B2May 27, 2014
Semiconductor packaging process using through silicon vias
HABA BELGACEM4 citations73
US8241959B2Aug 14, 2012
Microelectronic packages fabricated at the wafer level and methods therefor
HABA BELGACEM0 citations52
INVENSAS CORP
4 patentsUS10249673B2Apr 2, 2019
Rear-face illuminated solid state image sensors
INVENSAS CORP0 citations52
US9548145B2Jan 17, 2017
Microelectronic assembly with multi-layer support structure
INVENSAS CORP0 citations52
US9484379B2Nov 1, 2016
Rear-face illuminated solid state image sensors
INVENSAS CORP0 citations52
US8900910B2Dec 2, 2014
Rear-face illuminated solid state image sensors
INVENSAS CORP0 citations52