Inventor

THIENPONT DENISE

US2 patents

Patents

2 patents

US7439100B2Oct 21, 2008

Encapsulated chip scale package having flip-chip on lead frame structure and method

SEMICONDUCTOR COMPONENTS IND13 citations81

US7656048B2Feb 2, 2010

Encapsulated chip scale package having flip-chip on lead frame structure

SEMICONDUCTOR COMPONENTS IND7 citations71