Inventor

PANACCIONE PAUL J

US3 patents

⚠️ This page may combine multiple inventors who share the name “PANACCIONE PAUL J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

2 patents

US6815806B1Nov 9, 2004

Asymmetric partially-etched leads for finer pitch semiconductor chip package

IBM21 citations89

US7251872B2Aug 7, 2007

Method for forming a chip package

IBM3 citations59

ALLEGRO MICROSYSTEMS INC

1 patent

US5289344AFeb 22, 1994

Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means

ALLEGRO MICROSYSTEMS INC115 citations94