Inventor
MEI ZEQUN
US21 patents
⚠️ This page may combine multiple inventors who share the name “MEI ZEQUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LEDENGIN INC
9 patentsUS8773024B2Jul 8, 2014
Tuning of emitter with multiple LEDs to a single color bin
LEDENGIN INC33 citations93
US9024529B2May 5, 2015
Tuning of emitter with multiple LEDs to a single color bin
LEDENGIN INC5 citations83
US8900892B2Dec 2, 2014
Printing phosphor on LED wafer using dry film lithography
LEDENGIN INC7 citations76
US9794999B2Oct 17, 2017
Color tunable light source module with brightness and dimming control
LEDENGIN INC4 citations72
US9560713B2Jan 31, 2017
Color tunable light source module with brightness control
LEDENGIN INC3 citations72
US9234801B2Jan 12, 2016
Manufacturing method for LED emitter with high color consistency
LEDENGIN INC6 citations68
US9528665B2Dec 27, 2016
Phosphors for warm white emitters
LEDENGIN INC1 citations42
US9897284B2Feb 20, 2018
LED-based MR16 replacement lamp
LEDENGIN INC0 citations41
US9029879B2May 12, 2015
Phosphor cap for LED die top and lateral surfaces
LEDENGIN INC0 citations34
YAN XIANTAO
3 patentsUS8598793B2Dec 3, 2013
Tuning of emitter with multiple LEDs to a single color bin
YAN XIANTAO84 citations97
US8324641B2Dec 4, 2012
Matrix material including an embedded dispersion of beads for a light-emitting device
YAN XIANTAO27 citations92
US8587019B2Nov 19, 2013
Grooved plate for improved solder bonding
YAN XIANTAO7 citations82
MEI ZEQUN
3 patentsAGILENT TECHNOLOGIES INC
2 patentsUS6680128B2Jan 20, 2004
Method of making lead-free solder and solder paste with improved wetting and shelf life
AGILENT TECHNOLOGIES INC80 citations97
US6307160B1Oct 23, 2001
High-strength solder interconnect for copper/electroless nickel/immersion gold metallization solder pad and method
AGILENT TECHNOLOGIES INC84 citations94