Inventor

CHENG REN-SHIN

TW3 patents

Patents

3 patents

US9706656B2Jul 11, 2017

Signal transmission board and method for manufacturing the same

IND TECH RES INST9 citations82

US12027470B2Jul 2, 2024

Package carrier having a stiffener between solder bumps

IND TECH RES INST1 citations58

US11239141B2Feb 1, 2022

Lead frame package

IND TECH RES INST0 citations47