P

Inventor

CHO YOUN-JOUNG

KR41 patents
⚠️ This page may combine multiple inventors who share the name “CHO YOUN-JOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

38 patents
US11043553B2Jun 22, 2021

Integrated circuit device

SAMSUNG ELECTRONICS CO LTD6 citations83
US9812329B2Nov 7, 2017

Method of fabricating a semiconductor device

SAMSUNG ELECTRONICS CO LTD9 citations82
US9391089B2Jul 12, 2016

Method of manufacturing semiconductor device including nickel-containing film

SAMSUNG ELECTRONICS CO LTD4 citations73
US10134582B2Nov 20, 2018

Tantalum compound and methods of forming thin film and fabricating integrated circuit device by using the same

SAMSUNG ELECTRONICS CO LTD3 citations72
US9637511B2May 2, 2017

Method of forming thin film using a heterostructured nickel compound

SAMSUNG ELECTRONICS CO LTD4 citations72
US10913754B2Feb 9, 2021

Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compound

SAMSUNG ELECTRONICS CO LTD2 citations71
US9923047B2Mar 20, 2018

Method for manufacturing a capacitor for semiconductor devices

SAMSUNG ELECTRONICS CO LTD3 citations71
US10224200B2Mar 5, 2019

Aluminum compound, method of forming thin film by using the same, and method of fabricating integrated circuit device

SAMSUNG ELECTRONICS CO LTD2 citations70
US10049882B1Aug 14, 2018

Method for fabricating semiconductor device including forming a dielectric layer on a structure having a height difference using ALD

SAMSUNG ELECTRONICS CO LTD6 citations69
US10259836B2Apr 16, 2019

Methods of forming thin film and fabricating integrated circuit device using niobium compound

SAMSUNG ELECTRONICS CO LTD3 citations67
US7648854B2Jan 19, 2010

Methods of forming metal oxide layers, methods of forming gate structures using the same, and methods of forming capacitors using the same

SAMSUNG ELECTRONICS CO LTD3 citations63
US10882873B2Jan 5, 2021

Method of forming tin-containing material film and method of synthesizing a tin compound

SAMSUNG ELECTRONICS CO LTD0 citations62
US10242877B2Mar 26, 2019

Aluminum compound and methods of forming thin film and fabricating integrated circuit device by using the same

SAMSUNG ELECTRONICS CO LTD1 citations62
US7488684B2Feb 10, 2009

Organic aluminum precursor and method of forming a metal wire using the same

SAMSUNG ELECTRONICS CO LTD2 citations62
US7452569B2Nov 18, 2008

Organic aluminum precursor and method of manufacturing a metal wiring using the same

SAMSUNG ELECTRONICS CO LTD2 citations62
US12113035B2Oct 8, 2024

Semiconductor device and method for fabricating thereof

SAMSUNG ELECTRONICS CO LTD0 citations61
US11929389B2Mar 12, 2024

Integrated circuit device

SAMSUNG ELECTRONICS CO LTD0 citations61
US11848287B2Dec 19, 2023

Semiconductor device and method for fabricating thereof

SAMSUNG ELECTRONICS CO LTD0 citations61
US10468264B2Nov 5, 2019

Method of fabricating semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations61
US9359382B2Jun 7, 2016

β-ketoimine ligand, method of preparing the same, metal complex comprising the same and method of forming thin film using the same

SAMSUNG ELECTRONICS CO LTD2 citations61
US12588478B2Mar 24, 2026

Method of fabricating semiconductor device including organic and silicon oxide layers

SAMSUNG ELECTRONICS CO LTD0 citations60
US11062940B2Jul 13, 2021

Organometallic precursors, methods of forming a layer using the same and methods of manufacturing semiconductor devices using the same

SAMSUNG ELECTRONICS CO LTD0 citations60
US10319590B2Jun 11, 2019

Method of forming semiconductor device using metal-containing hardmask to pattern photoresist having protected polymer

SAMSUNG ELECTRONICS CO LTD1 citations58
US11901191B2Feb 13, 2024

Atomic layer etching method and semiconductor device manufacturing method using the same

SAMSUNG ELECTRONICS CO LTD0 citations57
US10923341B2Feb 16, 2021

Method of forming oxide layer and method of fabricating semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations56
US10752645B2Aug 25, 2020

Method of forming a thin film

SAMSUNG ELECTRONICS CO LTD0 citations51
US10651031B2May 12, 2020

Tantalum compound

SAMSUNG ELECTRONICS CO LTD0 citations51
US10329312B2Jun 25, 2019

Lanthanum compound, method of synthesizing lanthanum compound, lanthanum precursor composition, method of forming thin film, and method of manufacturing integrated circuit device

SAMSUNG ELECTRONICS CO LTD0 citations51
US9941114B2Apr 10, 2018

Organometallic precursors and methods of forming thin layers using the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US9790246B2Oct 17, 2017

Nickel compound and method of forming thin film using the nickel compound

SAMSUNG ELECTRONICS CO LTD0 citations51
US9425059B2Aug 23, 2016

Methods of forming a pattern and methods of manufacturing a semiconductor device using the same

SAMSUNG ELECTRONICS CO LTD1 citations51
US9472345B2Oct 18, 2016

Aluminum precursor, method of forming a thin film and method of forming a capacitor using the same

SAMSUNG ELECTRONICS CO LTD1 citations50
US9359383B2Jun 7, 2016

β-ketoimine ligand, method of preparing the same, metal complex comprising the same and method of forming thin film using the same

SAMSUNG ELECTRONICS CO LTD0 citations50
US12500079B2Dec 16, 2025

Semiconductor device manufacturing method

SAMSUNG ELECTRONICS CO LTD0 citations49
US10361118B2Jul 23, 2019

Organometallic precursors, methods of forming a layer using the same and methods of manufacturing semiconductor devices using the same

SAMSUNG ELECTRONICS CO LTD0 citations49
US12557370B2Feb 17, 2026

Semiconductor device manufacturing method

SAMSUNG ELECTRONICS CO LTD0 citations48
US10553449B2Feb 4, 2020

Methods of forming a silicon layer, methods of forming patterns, and methods of manufacturing semiconductor devices using the same

SAMSUNG ELECTRONICS CO LTD0 citations48
US9562299B2Feb 7, 2017

Copper electroplating solution and copper electroplating apparatus

SAMSUNG ELECTRONICS CO LTD0 citations45

CHO YOUN-JOUNG

2 patents

CHUNG WON WOONG

1 patent