Inventor
MILLER CURTIS JAMES
US3 patents
Patents
3 patentsUS7075174B2Jul 11, 2006
Semiconductor packaging techniques for use with non-ceramic packages
AGERE SYSTEMS INC4 citations58
US7074705B2Jul 11, 2006
Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
AGERE SYSTEMS INC2 citations53
US8025201B2Sep 27, 2011
Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
AGERE SYSTEMS INC1 citations42