Inventor

BUDD RUSSELL A

US88 patents

⚠️ This page may combine multiple inventors who share the name “BUDD RUSSELL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BUDD RUSSELL A

IBM

Compact optical system for use in virtual display applications

Chip handling and electronic component integration

Compact optical system and packaging for head mounted display

Head mounted display

Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications

Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications

Optical waveguide structure with waveguide coupler to facilitate off-chip coupling

Advanced handler wafer bonding and debonding

Silicon based optical vias

Coupling element alignment using waveguide fiducials

Coupling element alignment using waveguide fiducials

Chromatic and misalignment compensation in a multiple beam laser scanning system

Multiple laser beam scanning optics

Double layer release temporary bond and debond processes and systems

Double layer release temporary bond and debond processes and systems

Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications

Optical waveguide structure with waveguide coupler to facilitate off-chip coupling

Tapered photonic waveguide to optical fiber proximity coupler

Monolithically integrated III-V optoelectronics with SI CMOS

Fill head for full-field solder coverage with a rotatable member

Techniques for arranging solder balls and forming bumps

Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types

Optical component with angled-facet waveguide

Optical component with angled-facet waveguide

Medium containing optical paths and electrically conducting paths for applications in high speed data links

Chip handling and electronic component integration

Chip handling and electronic component integration

Structured substrate for optical fiber alignment

Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications

Structured substrate for optical fiber alignment

Structured substrate for optical fiber alignment

Method and apparatus for laser dicing of wafers

Structured substrate for optical fiber alignment

Method to create flexible connections for integrated circuits

Fill head interface with combination vacuum pressure chamber

Tamper detection at enclosure-to-board interface

Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array

Optical sensor system for quantitative colorimetric liquid analysis

Focus servo loop correction

BUDD RUSSELL A

Compact optical system and packaging for head mounted display

3D optoelectronic packaging

3D optoelectronic packaging

Silicon based optical vias

3D optoelectronic packaging

Multi-core fiber optical coupling elements

C4NP compliant solder fill head seals

ANDRY PAUL S

Silicon photonic chip optical coupling structures

Silicon carrier optoelectronic packaging

Silicon carrier optoelectronic packaging

AGILENT TECHNOLOGIES INC

Optical assembly with optoelectronic device alignment