Inventor

KUO CINDY

TW2 patents

⚠️ This page may combine multiple inventors who share the name “KUO CINDY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

1 patent

US9177914B2Nov 3, 2015

Metal pad structure over TSV to reduce shorting of upper metal layer

TAIWAN SEMICONDUCTOR MFG5 citations80

TAIWAN SEMICONDUCTOR MFG CO LTD

1 patent

US9530690B2Dec 27, 2016

Metal pad structure over TSV to reduce shorting of upper metal layer

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59