Inventor

WONG CHUN YU

US23 patents

⚠️ This page may combine multiple inventors who share the name “WONG CHUN YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WONG CHUN YU

GLOBALFOUNDRIES INC

Transistor fins with different thickness gate dielectric

Fin field-effect transistor (FinFET) and method of production thereof

Methods of fabricating nanowire structures

Self-aligned chamferless interconnect structures of semiconductor devices

Integrated circuits and methods of forming the same with metal layer connection to through-semiconductor via

Vertically oriented metal silicide containing e-fuse device and methods of making same

Self-aligned single diffusion break isolation with reduction of strain loss

Fins with single diffusion break facet improvement using epitaxial insulator

Through silicon via device having low stress, thin film gaps and methods for forming the same

Integrated circuits and methods of forming the same with multiple embedded interconnect connection to same through-semiconductor via

Vertically oriented metal silicide containing e-fuse device

Semiconductor fuses with nanowire fuse links and fabrication methods thereof

Semiconductor fuses with nanowire fuse links and fabrication methods thereof

STI structure with liner along lower portion of longitudinal sides of active region, and related FET and method

Fin-type transistors with spacers on the gates

Through silicon via device having low stress, thin film gaps and methods for forming the same

Hybrid material electrically programmable fuse and methods of forming

MICROSOFT CORP

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GLOBALFOUNDRIES US INC

Air gap regions of a semiconductor device

Preventing dielectric void over trench isolation region

PROCTER & GAMBLE

Dispensers and applicator heads therefor

WONG CHUN YU

3D integrated circuit system with connecting via structure and method for forming the same