Inventor
SCHLOTTIG GERD
CH25 patents
⚠️ This page may combine multiple inventors who share the name “SCHLOTTIG GERD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
24 patentsUS10153250B2Dec 11, 2018
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
IBM6 citations83
US9941189B2Apr 10, 2018
Counter-flow expanding channels for enhanced two-phase heat removal
IBM7 citations83
US9433077B2Aug 30, 2016
Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section
IBM5 citations81
US10006571B2Jun 26, 2018
Releasable, threadless conduit connector for liquid manifold
IBM4 citations73
US10727159B2Jul 28, 2020
Counter-flow expanding channels for enhanced two-phase heat removal
IBM3 citations72
US10527365B1Jan 7, 2020
Disconnect assembly for active cooling of packaged electronics
IBM4 citations72
US10388540B2Aug 20, 2019
High-performance compliant heat-exchanger comprising vapor chamber
IBM2 citations72
US9864152B1Jan 9, 2018
Optical assembly with optical coupler
IBM2 citations72
US9698089B2Jul 4, 2017
Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section
IBM4 citations70
US9066460B2Jun 23, 2015
Disassemblable electronic assembly with leak-inhibiting coolant capillaries
IBM6 citations70
US10107426B2Oct 23, 2018
Releasable, threadless conduit connector for liquid manifold
IBM1 citations63
US11251160B2Feb 15, 2022
Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask
IBM0 citations62
US10886254B2Jan 5, 2021
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
IBM0 citations62
US10132433B2Nov 20, 2018
Releasable, threadless conduit connector for liquid manifold
IBM0 citations52
US10767939B2Sep 8, 2020
Disconnect assembly for active cooling of packaged electronics
IBM0 citations51
US10727158B2Jul 28, 2020
Counter-flow expanding channels for enhanced two-phase heat removal
IBM0 citations51
US10551132B2Feb 4, 2020
Heat removal element with thermal expansion coefficient mismatch
IBM0 citations51
US10529648B2Jan 7, 2020
Counter-flow expanding channels for enhanced two-phase heat removal
IBM0 citations51
US10157814B1Dec 18, 2018
Compliant heat sink
IBM0 citations51
US9880595B2Jan 30, 2018
Cooling device with nested chambers for computer hardware
IBM0 citations51
US9397042B2Jul 19, 2016
Integrated helical multi-layer inductor structures
IBM1 citations51
US8907503B2Dec 9, 2014
Manufacturing an underfill in a semiconductor chip package
IBM1 citations51
US9230832B2Jan 5, 2016
Method for manufacturing a filled cavity between a first and a second surface
IBM0 citations41
US10763189B2Sep 1, 2020
Sealing arrangement
IBM0 citations40