P

Inventor

PARKS JOHN

US46 patents
⚠️ This page may combine multiple inventors who share the name “PARKS JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

17 patents
US7191787B1Mar 20, 2007

Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid

LAM RES CORP81 citations98
US7389783B2Jun 24, 2008

Proximity meniscus manifold

LAM RES CORP24 citations92
US7648584B2Jan 19, 2010

Method and apparatus for removing contamination from substrate

LAM RES CORP9 citations84
US7350315B2Apr 1, 2008

Edge wheel dry manifold

LAM RES CORP11 citations82
US7392815B2Jul 1, 2008

Chamber for wafer cleaning and method for making the same

LAM RES CORP6 citations74
US7089687B2Aug 15, 2006

Wafer edge wheel with drying function

LAM RES CORP5 citations74
US7591613B2Sep 22, 2009

Method and apparatus for transporting a substrate using non-newtonian fluid

LAM RES CORP3 citations63
US7416370B2Aug 26, 2008

Method and apparatus for transporting a substrate using non-Newtonian fluid

LAM RES CORP2 citations63
US7357115B2Apr 15, 2008

Wafer clamping apparatus and method for operating the same

LAM RES CORP3 citations63
US7254900B2Aug 14, 2007

Wafer edge wheel with drying function

LAM RES CORP5 citations63
US7293571B2Nov 13, 2007

Substrate proximity processing housing and insert for generating a fluid meniscus

LAM RES CORP4 citations62
US7896974B2Mar 1, 2011

Chamber for wafer cleaning and method for making the same

LAM RES CORP1 citations52
US7604011B2Oct 20, 2009

Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid

LAM RES CORP1 citations52
US7566370B2Jul 28, 2009

Wafer clamping apparatus and method for operating the same

LAM RES CORP0 citations52
US7406972B2Aug 5, 2008

Substrate proximity processing structures

LAM RES CORP1 citations52
US7153388B2Dec 26, 2006

Chamber for high-pressure wafer processing and method for making the same

LAM RES CORP1 citations52
US9287110B2Mar 15, 2016

Method and apparatus for wafer electroless plating

LAM RES CORP0 citations51

HEALTH MAN SYSTEMS INC

6 patents

THIE WILLIAM

4 patents

ENCORE PACKAGING LLC

3 patents

PLUG POWER INC

3 patents

APPLIED MATERIALS INC

2 patents

MOORING BEN

2 patents

FREER ERIK M

2 patents

SMART WIRES INC

2 patents

MINK SURF LLC

2 patents

BOYD JOHN

1 patent

AOD HOLDINGS LLC

1 patent

JMC STEEL GROUP INC

1 patent