Inventor
TSENG YUAN-TAI
TW73 patents
⚠️ This page may combine multiple inventors who share the name “TSENG YUAN-TAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
49 patentsUS10573811B2Feb 25, 2020
Resistive random-access memory (RRAM) cell with recessed bottom electrode sidewalls
TAIWAN SEMICONDUCTOR MFG CO LTD16 citations94
US10454021B2Oct 22, 2019
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations92
US11088203B2Aug 10, 2021
3D RRAM cell structure for reducing forming and set voltages
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10614948B2Apr 7, 2020
Method for forming inductor structure with magnetic material
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US10003022B2Jun 19, 2018
RRAM cell structure with conductive etch-stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9728719B2Aug 8, 2017
Leakage resistant RRAM/MIM structure
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9691883B2Jun 27, 2017
Asymmetric formation approach for a floating gate of a split gate flash memory structure
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9570454B2Feb 14, 2017
Structure with emedded EFS3 and FinFET device
TAIWAN SEMICONDUCTOR MFG CO LTD15 citations84
US9219109B2Dec 22, 2015
Inductor structure with magnetic material
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9048128B2Jun 2, 2015
Inductor structure with magnetic material
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US11871686B2Jan 9, 2024
Resistive random-access memory (RRAM) cell with recessed bottom electrode sidewalls
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11818962B2Nov 14, 2023
Sidewall spacer structure for memory cell
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11430956B2Aug 30, 2022
RRAM cell structure with conductive etch-stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11342379B2May 24, 2022
Trench formation scheme for programmable metallization cell to prevent metal redeposit
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11121308B2Sep 14, 2021
Sidewall spacer structure for memory cell
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11088202B2Aug 10, 2021
Method of forming memory cell
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10763304B2Sep 1, 2020
Semiconductor structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10720568B2Jul 21, 2020
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10283700B2May 7, 2019
Semiconductor memory structure with magnetic tunnel junction (MTJ) cell
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10276634B2Apr 30, 2019
Semiconductor memory structure with magnetic tunnel junction (MTJ) cell
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9954100B2Apr 24, 2018
Method and apparatus for high voltate transistors
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9768220B2Sep 19, 2017
Deep trench isolation structure for image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US9627467B2Apr 18, 2017
Thin film resistor integrated between interconnect levels and contacting an underlying dielectric layer protrusion
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9589976B2Mar 7, 2017
Structure and method to reduce polysilicon loss from flash memory devices during replacement gate (RPG) process in integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9502515B2Nov 22, 2016
Split gate flash memory structure with a damage free select gate and a method of making the split gate flash memory structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9472645B1Oct 18, 2016
Dual control gate spacer structure for embedded flash memory
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9257571B1Feb 9, 2016
Memory gate first approach to forming a split gate flash memory cell device
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US11532697B2Dec 20, 2022
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10164181B2Dec 25, 2018
Sidewall protection of memory cell
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12369332B2Jul 22, 2025
Memory device for reducing thermal crosstalk
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11950434B2Apr 2, 2024
Memory device for reducing thermal crosstalk
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11805660B2Oct 31, 2023
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11742262B2Aug 29, 2023
Integrated circuit having a resistor layer partially overlapping endcaps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11569296B2Jan 31, 2023
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11289648B2Mar 29, 2022
Resistive random-access memory (RRAM) cell with recessed bottom electrode sidewalls
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11189789B2Nov 30, 2021
Resistive random-access memory (RRAM) cell with recessed bottom electrode sidewalls
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11158797B2Oct 26, 2021
RRAM cell structure with conductive etch-stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11158789B2Oct 26, 2021
Leakage resistant RRAM/MIM structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11037983B2Jun 15, 2021
Semiconductor structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11005037B2May 11, 2021
Leakage resistant RRAM/MIM structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10985090B2Apr 20, 2021
Methods of manufacturing a thin film resistor with ends overlapped by interconnect pads
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9865389B2Jan 9, 2018
Inductor structure with magnetic material
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9269829B2Feb 23, 2016
Split gate flash memory structure with a damage free select gate and a method of making the split gate flash memory structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US9159842B1Oct 13, 2015
Embedded nonvolatile memory
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations63
US12477746B2Nov 18, 2025
Method of forming memory cell
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12354695B2Jul 8, 2025
Trench formation scheme for programmable metallization cell to prevent metal redeposit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12310261B2May 20, 2025
Memory device having via landing protection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12274182B2Apr 8, 2025
Sidewall spacer structure for memory cell
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12048258B2Jul 23, 2024
Phase change memory device and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
TAIWAN SEMICONDUCTOR MFG
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