P

Inventor

TSENG YUAN-TAI

TW73 patents
⚠️ This page may combine multiple inventors who share the name “TSENG YUAN-TAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

49 patents
US10573811B2Feb 25, 2020

Resistive random-access memory (RRAM) cell with recessed bottom electrode sidewalls

TAIWAN SEMICONDUCTOR MFG CO LTD16 citations94
US10454021B2Oct 22, 2019

Semiconductor structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations92
US11088203B2Aug 10, 2021

3D RRAM cell structure for reducing forming and set voltages

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10614948B2Apr 7, 2020

Method for forming inductor structure with magnetic material

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US10003022B2Jun 19, 2018

RRAM cell structure with conductive etch-stop layer

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9728719B2Aug 8, 2017

Leakage resistant RRAM/MIM structure

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9691883B2Jun 27, 2017

Asymmetric formation approach for a floating gate of a split gate flash memory structure

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9570454B2Feb 14, 2017

Structure with emedded EFS3 and FinFET device

TAIWAN SEMICONDUCTOR MFG CO LTD15 citations84
US9219109B2Dec 22, 2015

Inductor structure with magnetic material

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9048128B2Jun 2, 2015

Inductor structure with magnetic material

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US11871686B2Jan 9, 2024

Resistive random-access memory (RRAM) cell with recessed bottom electrode sidewalls

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11818962B2Nov 14, 2023

Sidewall spacer structure for memory cell

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11430956B2Aug 30, 2022

RRAM cell structure with conductive etch-stop layer

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11342379B2May 24, 2022

Trench formation scheme for programmable metallization cell to prevent metal redeposit

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11121308B2Sep 14, 2021

Sidewall spacer structure for memory cell

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11088202B2Aug 10, 2021

Method of forming memory cell

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10763304B2Sep 1, 2020

Semiconductor structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10720568B2Jul 21, 2020

Semiconductor structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10283700B2May 7, 2019

Semiconductor memory structure with magnetic tunnel junction (MTJ) cell

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10276634B2Apr 30, 2019

Semiconductor memory structure with magnetic tunnel junction (MTJ) cell

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9954100B2Apr 24, 2018

Method and apparatus for high voltate transistors

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9768220B2Sep 19, 2017

Deep trench isolation structure for image sensors

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US9627467B2Apr 18, 2017

Thin film resistor integrated between interconnect levels and contacting an underlying dielectric layer protrusion

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9589976B2Mar 7, 2017

Structure and method to reduce polysilicon loss from flash memory devices during replacement gate (RPG) process in integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9502515B2Nov 22, 2016

Split gate flash memory structure with a damage free select gate and a method of making the split gate flash memory structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9472645B1Oct 18, 2016

Dual control gate spacer structure for embedded flash memory

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9257571B1Feb 9, 2016

Memory gate first approach to forming a split gate flash memory cell device

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US11532697B2Dec 20, 2022

Semiconductor structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10164181B2Dec 25, 2018

Sidewall protection of memory cell

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12369332B2Jul 22, 2025

Memory device for reducing thermal crosstalk

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11950434B2Apr 2, 2024

Memory device for reducing thermal crosstalk

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11805660B2Oct 31, 2023

Semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11742262B2Aug 29, 2023

Integrated circuit having a resistor layer partially overlapping endcaps

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11569296B2Jan 31, 2023

Semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11289648B2Mar 29, 2022

Resistive random-access memory (RRAM) cell with recessed bottom electrode sidewalls

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11189789B2Nov 30, 2021

Resistive random-access memory (RRAM) cell with recessed bottom electrode sidewalls

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11158797B2Oct 26, 2021

RRAM cell structure with conductive etch-stop layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11158789B2Oct 26, 2021

Leakage resistant RRAM/MIM structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11037983B2Jun 15, 2021

Semiconductor structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11005037B2May 11, 2021

Leakage resistant RRAM/MIM structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10985090B2Apr 20, 2021

Methods of manufacturing a thin film resistor with ends overlapped by interconnect pads

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9865389B2Jan 9, 2018

Inductor structure with magnetic material

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9269829B2Feb 23, 2016

Split gate flash memory structure with a damage free select gate and a method of making the split gate flash memory structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US9159842B1Oct 13, 2015

Embedded nonvolatile memory

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations63
US12477746B2Nov 18, 2025

Method of forming memory cell

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12354695B2Jul 8, 2025

Trench formation scheme for programmable metallization cell to prevent metal redeposit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12310261B2May 20, 2025

Memory device having via landing protection

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12274182B2Apr 8, 2025

Sidewall spacer structure for memory cell

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12048258B2Jul 23, 2024

Phase change memory device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

TAIWAN SEMICONDUCTOR MFG

1 patent

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