Inventor
HASHIMOTO YOSHITOMO
JP67 patents
⚠️ This page may combine multiple inventors who share the name “HASHIMOTO YOSHITOMO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
37 patentsUS10770287B2Sep 8, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP6 citations84
US11935742B2Mar 19, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations73
US11817314B2Nov 14, 2023
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations73
US11626280B2Apr 11, 2023
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations73
US11183382B2Nov 23, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP2 citations73
US11164741B2Nov 2, 2021
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations73
US11515143B2Nov 29, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and method of processing substrate
KOKUSAI ELECTRIC CORP2 citations72
US11417518B2Aug 16, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP4 citations72
US11527402B2Dec 13, 2022
Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP4 citations71
US11728165B2Aug 15, 2023
Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations63
US12581878B2Mar 17, 2026
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12525450B2Jan 13, 2026
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12400874B2Aug 26, 2025
Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12288684B2Apr 29, 2025
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12283478B2Apr 22, 2025
Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12243753B2Mar 4, 2025
Method and apparatus for selective film formation in semiconductor substrate processing
KOKUSAI ELECTRIC CORP0 citations62
US12033852B2Jul 9, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12009201B2Jun 11, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11967499B2Apr 23, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11894239B2Feb 6, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11664217B2May 30, 2023
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11315800B2Apr 26, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11056337B2Jul 6, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US10930491B2Feb 23, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12278103B2Apr 15, 2025
Method of processing substrate and method of manufacturing semiconductor device by forming film
KOKUSAI ELECTRIC CORP0 citations61
US11978623B2May 7, 2024
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US11848203B2Dec 19, 2023
Methods of processing substrate and manufacturing semiconductor device by forming film, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12571094B2Mar 10, 2026
Method of processing substrate, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US12424437B2Sep 23, 2025
Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US12406843B2Sep 2, 2025
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US12381091B2Aug 5, 2025
Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations60
US11961733B2Apr 16, 2024
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations60
US11823886B2Nov 21, 2023
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11699593B2Jul 11, 2023
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US12424463B2Sep 23, 2025
Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording medium
KOKUSAI ELECTRIC CORP0 citations59
US12334334B2Jun 17, 2025
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations56
US12392031B2Aug 19, 2025
Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations52
HITACHI INT ELECTRIC INC
13 patentsUS9218959B2Dec 22, 2015
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC6 citations84
US9054046B2Jun 9, 2015
Method of manufacturing semiconductor device and method of processing substrate
HITACHI INT ELECTRIC INC10 citations84
US9620357B2Apr 11, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC8 citations83
US9704703B2Jul 11, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC3 citations73
US9583338B2Feb 28, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC5 citations73
US9460911B2Oct 4, 2016
Method of manufacturing semiconductor device and substrate processing method
HITACHI INT ELECTRIC INC4 citations73
US8785333B2Jul 22, 2014
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC6 citations73
US10229829B2Mar 12, 2019
Method for manufacturing semiconductor device, substrate-processing apparatus, and recording medium
HITACHI INT ELECTRIC INC3 citations72
US10163625B2Dec 25, 2018
Method for manufacturing semiconductor device, substrate-processing apparatus, and recording medium
HITACHI INT ELECTRIC INC2 citations72
US10600642B2Mar 24, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC1 citations63
US9837261B2Dec 5, 2017
Method of manufacturing semiconductor device and substrate processing method
HITACHI INT ELECTRIC INC1 citations63
US10626502B2Apr 21, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC1 citations62
US12094708B2Sep 17, 2024
Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations61
Showing the top 50 of 67 patents by PatentIndex Score.