P

Inventor

KIM CHULWOO

KR58 patents
⚠️ This page may combine multiple inventors who share the name “KIM CHULWOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

20 patents
US8350158B2Jan 8, 2013

Tape wiring substrates and packages including the same

SAMSUNG ELECTRONICS CO LTD11 citations83
US11721679B2Aug 8, 2023

Semiconductor package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD1 citations71
US11145637B2Oct 12, 2021

Semiconductor package including a substrate having two silicon layers formed on each other

SAMSUNG ELECTRONICS CO LTD4 citations71
US9620494B2Apr 11, 2017

Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages

SAMSUNG ELECTRONICS CO LTD3 citations71
US12451871B2Oct 21, 2025

Semiconductor device

SAMSUNG ELECTRONICS CO LTD2 citations70
US10567877B2Feb 18, 2020

Method and electronic device for playing audio data using dual speaker

SAMSUNG ELECTRONICS CO LTD3 citations70
US12113049B2Oct 8, 2024

Semiconductor package and method of manufacturing semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations62
US11855041B2Dec 26, 2023

Semiconductor package and method of manufacturing semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations62
US11508652B2Nov 22, 2022

Semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations62
US12278222B2Apr 15, 2025

Method of fabricating semiconductor package including sub-interposer substrates

SAMSUNG ELECTRONICS CO LTD0 citations61
US11670565B2Jun 6, 2023

Semiconductor package with heat dissipation member

SAMSUNG ELECTRONICS CO LTD0 citations61
US11569145B2Jan 31, 2023

Semiconductor package with thermal interface material for improving package reliability

SAMSUNG ELECTRONICS CO LTD1 citations61
US7639086B2Dec 29, 2009

Thermometer code generator, and frequency-locked loop including the same

SAMSUNG ELECTRONICS CO LTD4 citations61
US12057408B2Aug 6, 2024

Semiconductor packages

SAMSUNG ELECTRONICS CO LTD0 citations59
US12542548B2Feb 3, 2026

Receiver including a pulse amplitude modulation decoder, and a memory device including the same

SAMSUNG ELECTRONICS CO LTD0 citations58
US12211572B2Jan 28, 2025

Semiconductor device and memory system

SAMSUNG ELECTRONICS CO LTD0 citations58
US11936409B2Mar 19, 2024

Data transmitting and receiving device

SAMSUNG ELECTRONICS CO LTD0 citations58
US11095484B2Aug 17, 2021

Differential signal processing device using advanced braid clock signaling

SAMSUNG ELECTRONICS CO LTD0 citations58
US11501069B2Nov 15, 2022

Electronic device for inputting characters and method of operation of same

SAMSUNG ELECTRONICS CO LTD0 citations52
US11217539B2Jan 4, 2022

Package substrate and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations52

UNIV KOREA RES & BUS FOUND

9 patents

UNIV ILLINOIS

4 patents

UNIV IND & ACAD COLLABORATION

3 patents

SEMES CO LTD

3 patents

SON DAEWOO

2 patents

HYNIX SEMICONDUCTOR INC

2 patents

KIM CHULWOO

2 patents

SK HYNIX INC

2 patents

UNIV HONG KONG SCIENCE & TECH

1 patent

SK TELECOM CO LTD

1 patent

IBM

1 patent

Showing the top 50 of 58 patents by PatentIndex Score.