Inventor
KIM CHULWOO
KR58 patents
⚠️ This page may combine multiple inventors who share the name “KIM CHULWOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
20 patentsUS8350158B2Jan 8, 2013
Tape wiring substrates and packages including the same
SAMSUNG ELECTRONICS CO LTD11 citations83
US11721679B2Aug 8, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations71
US11145637B2Oct 12, 2021
Semiconductor package including a substrate having two silicon layers formed on each other
SAMSUNG ELECTRONICS CO LTD4 citations71
US9620494B2Apr 11, 2017
Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages
SAMSUNG ELECTRONICS CO LTD3 citations71
US12451871B2Oct 21, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations70
US10567877B2Feb 18, 2020
Method and electronic device for playing audio data using dual speaker
SAMSUNG ELECTRONICS CO LTD3 citations70
US12113049B2Oct 8, 2024
Semiconductor package and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11855041B2Dec 26, 2023
Semiconductor package and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11508652B2Nov 22, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US12278222B2Apr 15, 2025
Method of fabricating semiconductor package including sub-interposer substrates
SAMSUNG ELECTRONICS CO LTD0 citations61
US11670565B2Jun 6, 2023
Semiconductor package with heat dissipation member
SAMSUNG ELECTRONICS CO LTD0 citations61
US11569145B2Jan 31, 2023
Semiconductor package with thermal interface material for improving package reliability
SAMSUNG ELECTRONICS CO LTD1 citations61
US7639086B2Dec 29, 2009
Thermometer code generator, and frequency-locked loop including the same
SAMSUNG ELECTRONICS CO LTD4 citations61
US12057408B2Aug 6, 2024
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations59
US12542548B2Feb 3, 2026
Receiver including a pulse amplitude modulation decoder, and a memory device including the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US12211572B2Jan 28, 2025
Semiconductor device and memory system
SAMSUNG ELECTRONICS CO LTD0 citations58
US11936409B2Mar 19, 2024
Data transmitting and receiving device
SAMSUNG ELECTRONICS CO LTD0 citations58
US11095484B2Aug 17, 2021
Differential signal processing device using advanced braid clock signaling
SAMSUNG ELECTRONICS CO LTD0 citations58
US11501069B2Nov 15, 2022
Electronic device for inputting characters and method of operation of same
SAMSUNG ELECTRONICS CO LTD0 citations52
US11217539B2Jan 4, 2022
Package substrate and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations52
UNIV KOREA RES & BUS FOUND
9 patentsUS9461665B1Oct 4, 2016
Successive approximated register analog-to-digital converter and conversion method thereof
UNIV KOREA RES & BUS FOUND25 citations94
US10491237B1Nov 26, 2019
Continuous-time delta-sigma modulator
UNIV KOREA RES & BUS FOUND8 citations78
US11842022B2Dec 12, 2023
Electronic device including capacitive sensor driven by stylus excited by magnetic field, touch system including the same, and operating method thereof
UNIV KOREA RES & BUS FOUND2 citations72
US10897382B2Jan 19, 2021
Pulse amplitude modulation-3 transceiver and operation method thereof
UNIV KOREA RES & BUS FOUND4 citations70
US11088878B2Aug 10, 2021
Transceiver using multi-level braid signaling and method of operating the same
UNIV KOREA RES & BUS FOUND2 citations68
US10996807B2May 4, 2021
Touch sensor with modular shape and display device including the same
UNIV KOREA RES & BUS FOUND0 citations62
US11025269B2Jun 1, 2021
Capacitively coupled continuous-time delta-sigma modulator and operation method thereof
UNIV KOREA RES & BUS FOUND0 citations55
US11979160B2May 7, 2024
Single-signal receiver including active inductor continuous time linear equalizer and reference voltage selection equalizer, and method for operating the same
UNIV KOREA RES & BUS FOUND0 citations53
US11836315B2Dec 5, 2023
Electronic device for identifying touch position, touch system including electronic device, and operation method thereof
UNIV KOREA RES & BUS FOUND0 citations51
UNIV ILLINOIS
4 patentsUS6784707B2Aug 31, 2004
Delay locked loop clock generator
UNIV ILLINOIS42 citations92
US6624665B2Sep 23, 2003
CMOS skewed static logic and method of synthesis
UNIV ILLINOIS21 citations92
US6784694B2Aug 31, 2004
CMOS sequential logic configuration for an edge triggered flip-flop
UNIV ILLINOIS10 citations74
US6794903B2Sep 21, 2004
CMOS parallel dynamic logic and speed enhanced static logic
UNIV ILLINOIS4 citations63
UNIV IND & ACAD COLLABORATION
3 patentsUS7791377B2Sep 7, 2010
Hierarchical time to digital converter
UNIV IND & ACAD COLLABORATION10 citations81
US7914204B2Mar 29, 2011
Apparatus and method for measurement of temperature using oscillators
UNIV IND & ACAD COLLABORATION9 citations80
US8024598B2Sep 20, 2011
Apparatus and method for clock generation with piecewise linear modulation
UNIV IND & ACAD COLLABORATION13 citations74
SEMES CO LTD
3 patentsUS11485132B2Nov 1, 2022
Method of maintaining an ink jet head and printing method using an ink jet head
SEMES CO LTD2 citations70
US12558898B2Feb 24, 2026
Chemical liquid removing unit, device for supplying chemical liquid and method of removing chemical liquid
SEMES CO LTD0 citations59
US11312127B2Apr 26, 2022
Apparatus for discharging chemical liquid and method of discharging chemical liquid
SEMES CO LTD0 citations59
SON DAEWOO
2 patentsUS8836149B2Sep 16, 2014
Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages
SON DAEWOO14 citations88
US9460937B2Oct 4, 2016
Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages
SON DAEWOO4 citations69
HYNIX SEMICONDUCTOR INC
2 patentsKIM CHULWOO
2 patentsSK HYNIX INC
2 patentsUNIV HONG KONG SCIENCE & TECH
1 patentSK TELECOM CO LTD
1 patentIBM
1 patentShowing the top 50 of 58 patents by PatentIndex Score.