Inventor
BASKARAN RAJASHREE
US36 patents
⚠️ This page may combine multiple inventors who share the name “BASKARAN RAJASHREE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
30 patentsUS7517228B2Apr 14, 2009
Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit
INTEL CORP28 citations92
US11320883B2May 3, 2022
Multi-die stacks with power management
INTEL CORP6 citations84
US9503829B2Nov 22, 2016
Ear pressure sensors integrated with speakers for smart sound level exposure
INTEL CORP10 citations83
US9720496B2Aug 1, 2017
Techniques for stabilizing a display scene output
INTEL CORP7 citations82
US10455324B2Oct 22, 2019
Apparatus and methods for bone conduction context detection
INTEL CORP9 citations81
US7902617B2Mar 8, 2011
Forming a thin film electric cooler and structures formed thereby
INTEL CORP6 citations74
US7476568B2Jan 13, 2009
Wafer-level assembly of heat spreaders for dual IHS packages
INTEL CORP6 citations74
US7449361B2Nov 11, 2008
Semiconductor substrate with islands of diamond and resulting devices
INTEL CORP8 citations74
US9400557B2Jul 26, 2016
Multimodal haptic effect system
INTEL CORP6 citations73
US9294035B2Mar 22, 2016
Multigate resonant channel transistor
INTEL CORP6 citations71
US11422551B2Aug 23, 2022
Technologies for providing a cognitive capacity test for autonomous driving
INTEL CORP5 citations70
US11356772B2Jun 7, 2022
Apparatus and methods for bone conduction context detection
INTEL CORP1 citations70
US10827261B2Nov 3, 2020
Apparatus and methods for bone conduction context detection
INTEL CORP2 citations70
US9513311B2Dec 6, 2016
Inertial sensor pendulum test apparatus
INTEL CORP4 citations65
US7833816B2Nov 16, 2010
Forming a thin film thermoelectric cooler and structures formed thereby
INTEL CORP4 citations63
US7666714B2Feb 23, 2010
Assembly of thin die coreless package
INTEL CORP2 citations63
US7557438B2Jul 7, 2009
Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same
INTEL CORP6 citations63
US7723759B2May 25, 2010
Stacked wafer or die packaging with enhanced thermal and device performance
INTEL CORP6 citations62
US7371630B2May 13, 2008
Patterned backside stress engineering for transistor performance optimization
INTEL CORP2 citations62
US12066833B2Aug 20, 2024
Computer-assisted or autonomous driving assisted by roadway navigation broadcast
INTEL CORP0 citations61
US11822410B2Nov 21, 2023
Multi-die stacks with power management
INTEL CORP0 citations61
US11009890B2May 18, 2021
Computer-assisted or autonomous driving assisted by roadway navigation broadcast
INTEL CORP0 citations61
US11849280B2Dec 19, 2023
Apparatus and methods for bone conduction context detection
INTEL CORP0 citations59
US10236282B2Mar 19, 2019
Partial layer transfer system and method
INTEL CORP0 citations52
US9818751B2Nov 14, 2017
Methods of forming buried vertical capacitors and structures formed thereby
INTEL CORP0 citations52
US7875934B2Jan 25, 2011
Semiconductor substrate with islands of diamond and resulting devices
INTEL CORP1 citations52
US7821073B2Oct 26, 2010
Patterned backside stress engineering for transistor performance optimization
INTEL CORP0 citations52
US9850121B2Dec 26, 2017
Backside bulk silicon MEMS
INTEL CORP0 citations51
US11551551B2Jan 10, 2023
Technologies for providing guidance for autonomous vehicles in areas of low network connectivity
INTEL CORP0 citations47
US9061890B2Jun 23, 2015
Methods of forming buried electromechanical structures coupled with device substrates and structures formed thereby
INTEL CORP0 citations42