Inventor

PIETSCH GEORG

DE25 patents

⚠️ This page may combine multiple inventors who share the name “PIETSCH GEORG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PIETSCH GEORG

SILTRONIC AG

Semiconductor wafer, apparatus and process for producing the semiconductor wafer

Method for the simultaneous double-side grinding of a plurality of semiconductor wafers

Method for simultaneously cutting a multiplicity of wafers from a workpiece

Method and apparatus for trimming the working layers of a double-side grinding apparatus

Method for producing discs from a cylindrical rod made of a semiconductor material

Method for separating multiple slices of workpieces by means of a wire saw during a sequence of separation processes

Method and apparatus for simultaneously slicing a multiplicity of slices from a workpiece

Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot

Method for trimming the working layers of a double-side grinding apparatus

Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpiece

Apparatus and method for simultaneously slicing a multiplicity of slices from a workpiece

PIETSCH GEORG

Method for the simultaneous grinding of a plurality of semiconductor wafers

Device and method for buffer-storing a multiplicity of wafer-type workpieces

Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers

Method for trimming the working layers of a double-side grinding apparatus

Method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers

Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers

Methods for producing and processing semiconductor wafers

Method for the simultaneous double-side material-removing processing of at least three workpieces

Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus

WACKER SILTRONIC HALBLEITERMAT

Method for manufacturing a semiconductor wafer which is coated on one side and provided with a finish

Method and device for removing a semiconductor wafer from a flat substrate

SCHWANDNER JUERGEN

Method for polishing a substrate composed of semiconductor material

Method for producing a semiconductor wafer

KERSTAN MICHAEL

Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers