Inventor
MACKAY COLIN A
US18 patents
Patents
18 patentsUS5170930ADec 15, 1992
Liquid metal paste for thermal and electrical connections
MICROELECTRONICS & COMPUTER168 citations99
US4991290AFeb 12, 1991
Flexible electrical interconnect and method of making
MICROELECTRONICS & COMPUTER221 citations99
US5503948AApr 2, 1996
Thin cell electrochemical battery system; and method of interconnecting multiple thin cells
MICROELECTRONICS & COMPUTER80 citations96
US5393613AFeb 28, 1995
Composition for three-dimensional metal fabrication using a laser
MICROELECTRONICS & COMPUTER91 citations96
US5314003AMay 24, 1994
Three-dimensional metal fabrication using a laser
MICROELECTRONICS & COMPUTER84 citations96
US5056706AOct 15, 1991
Liquid metal paste for thermal and electrical connections
MICROELECTRONICS & COMPUTER59 citations96
US5053195AOct 1, 1991
Bonding amalgam and method of making
MICROELECTRONICS & COMPUTER77 citations96
US5049718ASep 17, 1991
Method of laser bonding for gold, gold coated and gold alloy coated electrical members
MICROELECTRONICS & COMPUTER63 citations94
US5393573AFeb 28, 1995
Method of inhibiting tin whisker growth
MICROELECTRONICS & COMPUTER49 citations92
US5250329AOct 5, 1993
Method of depositing conductive lines on a dielectric
MICROELECTRONICS & COMPUTER75 citations92
US5225157AJul 6, 1993
Amalgam composition for room temperature bonding
MICROELECTRONICS & COMPUTER36 citations92
US5076485ADec 31, 1991
Bonding electrical leads to pads with particles
MICROELECTRONICS & COMPUTER43 citations92
US5124175AJun 23, 1992
Method of patterned metal reflow on interconnect substrates
MICROELECTRONICS & COMPUTER23 citations91
US4971144ANov 20, 1990
Liquid ribbon cooler
MICROELECTRONICS & COMPUTER24 citations90
US4995551AFeb 26, 1991
Bonding electrical leads to pads on electrical components
MICROELECTRONICS & COMPUTER13 citations74
US4862588ASep 5, 1989
Method of making a flexible interconnect
MICROELECTRONICS & COMPUTER15 citations74
US4754900AJul 5, 1988
Method of and apparatus for dispensing a controlled amount of a liquid metal
MICROELECTRONICS & COMPUTER15 citations74
US5008512AApr 16, 1991
Method of laser bonding electrical members
MICROELECTRONICS & COMPUTER13 citations66