Inventor
NICOL DAVID B
US2 patents
Patents
2 patentsUS9691698B2Jun 27, 2017
Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
HARRIS CORP2 citations68
US9420687B2Aug 16, 2016
Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
HARRIS CORP0 citations48