Inventor
CHARVAT PETER K
US7 patents
Patents
7 patentsUS5619071AApr 8, 1997
Anchored via connection
INTEL CORP69 citations95
US5470790ANov 28, 1995
Via hole profile and method of fabrication
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US5874358AFeb 23, 1999
Via hole profile and method of fabrication
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US5262279ANov 16, 1993
Dry process for stripping photoresist from a polyimide surface
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US5242864ASep 7, 1993
Polyimide process for protecting integrated circuits
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US5202291AApr 13, 1993
High CF4 flow-reactive ion etch for aluminum patterning
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US5549784AAug 27, 1996
Method for etching silicon oxide films in a reactive ion etch system to prevent gate oxide damage
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